参数资料
型号: MCHC11F1CFNE3R
厂商: Freescale Semiconductor
文件页数: 108/158页
文件大小: 0K
描述: MCU 8BIT 1KRAM 512EE 68-PLCC
标准包装: 250
系列: HC11
核心处理器: HC11
芯体尺寸: 8-位
速度: 3MHz
连通性: SCI,SPI
外围设备: POR,WDT
输入/输出数: 30
程序存储器类型: ROMless
EEPROM 大小: 512 x 8
RAM 容量: 1K x 8
电压 - 电源 (Vcc/Vdd): 4.75 V ~ 5.25 V
数据转换器: A/D 8x8b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 68-LCC(J 形引线)
包装: 带卷 (TR)
OPERATING MODES AND ON-CHIP MEMORY
TECHNICAL DATA
4-15
Recall that zeros must be erased by a separate erase operation before programming.
The following example of how to program an EEPROM byte assumes that the appro-
priate bits in BPROT have been cleared and the data to be programmed is present in
accumulator A.
4.4.1.2 EEPROM Bulk Erase
To erase the EEPROM, ensure that the proper bits of the BPROT register are cleared,
then complete the following steps using the PPROG register:
1. Write to PPROG with the ERASE, EELAT, and appropriate BYTE and ROW
bits set.
2. Write to the appropriate EEPROM address with any data. Row erase only re-
quires a write to any location in the row. Bulk erase is accomplished by writing
to any location in the array.
3. Write to PPROG with ERASE, EELAT, EEPGM, and the appropriate BYTE and
ROW bits set.
4. Delay for 10 ms or more, as appropriate.
5. Clear the EEPGM bit in PPROG to turn off the high voltage.
6. Return to step 1 for next byte or row or proceed to step 7.
7. Clear the PPROG register to reconfigure the EEPROM address and data buses
for normal operation.
The following is an example of how to bulk erase the 512-byte EEPROM. The CONFIG
register is not affected in this example. When bulk erasing the CONFIG register, CON-
FIG and the 512-byte array are all erased.
4.4.1.3 EEPROM Row Erase
The following example shows how to perform a fast erase of large sections of EE-
PROM and assumes that index register X contains the address of a location in the de-
sired row.
PROG
LDAB
#$02
EELAT=1, EEPGM=0
STAB
$103B
Set EELAT bit
STAA
$FE00
Store data to EEPROM address
LDAB
#$03
EELAT=1, EEPGM=1
STAB
$103B
Turn on programming voltage
JSR
DLY10
Delay 10 ms
CLR
$103B
Turn off high voltage and set to READ mode
BULKE
LDAB
#$06
ERASE=1, EELAT=1, EEPGM=0
STAB
$103B
Set EELAT bit
STAB
$FE00
Store any data to any EEPROM address
LDAB
#$07
EELAT=1, EEPGM=1
STAB
$103B
Turn on programming voltage
JSR
DLY10
Delay 10 ms
CLR
$103B
Turn off high voltage and set to READ mode
F
re
e
sc
a
le
S
e
m
ic
o
n
d
u
c
to
r,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
c
..
.
相关PDF资料
PDF描述
EGG.1B.308.CLL CONN RCPT 8POS PNL MNT SKT W/NUT
FGG.1B.304.CLAD52Z CONN PLUG 4POS STRGHT PIN SOLDER
VI-BVN-IX-B1 CONVERTER MOD DC/DC 18.5V 75W
VI-BVL-IX-B1 CONVERTER MOD DC/DC 28V 75W
MC9328MX21SVKR2 IC MCU I.MX21 266MHZ 289-MAPBGA
相关代理商/技术参数
参数描述
MCHC11F1CFNE4 功能描述:8位微控制器 -MCU 8B MCU 1KRAM 512EE RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
MCHC11F1CFNE4R 功能描述:8位微控制器 -MCU 8B MCU 1KRAM 512EE RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
MCHC11F1CFNE5 功能描述:8位微控制器 -MCU 8B MCU 1KRAM 512EE RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
MCHC11F1MFNE4 制造商:Freescale Semiconductor 功能描述:8-BIT MCU,1KRAM,512EE,A/ - Rail/Tube
MCHC11F1VFNE3 功能描述:8位微控制器 -MCU 8B MCU 1KRAM 512EE RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT