参数资料
型号: MCIMX27MOP4A
厂商: Freescale Semiconductor
文件页数: 97/152页
文件大小: 0K
描述: IC MPU I.MX27 19X19 473MAPBGA
标准包装: 84
系列: i.MX27
核心处理器: ARM9
芯体尺寸: 32-位
速度: 400MHz
连通性: 1 线,CAN,EBI/EMI,以太网,I²C,MMC,智能卡,SPI,SSI,UART/USART,USB OTG
外围设备: DMA,LCD,POR,PWM,WDT
程序存储器类型: ROMless
RAM 容量: 45K x 8
电压 - 电源 (Vcc/Vdd): 1.38 V ~ 1.52 V
振荡器型: 外部
工作温度: -40°C ~ 85°C
封装/外壳: 473-LFBGA
包装: 托盘
i.MX27 and i.MX27L Data Sheet, Rev. 1.8
Freescale Semiconductor
49
Electrical Characteristics
Figure 8. ATA interface Signals Timing Diagram
4.2.4
Digital Audio Mux (AUDMUX)
The AUDMUX provides a programmable interconnect logic for voice, audio and data routing between
internal serial interfaces (SSI, SAP) and external serial interfaces (audio and voice codecs). The AC timing
of AUDMUX external pins is hence governed by SSI and SAP modules. Please refer to their respective
electrical specifications.
4.2.5
CMOS Sensor Interface (CSI)
This section describes the electrical information (AC timing) of the CSI.
4.2.5.1
Gated Clock Mode Timing
VSYNC, HSYNC, and PIXCLK signals are used in this mode. A frame starts with a rising/falling edge on
VSYNC, then HSYNC goes high and holds for the entire line. The pixel clock is valid as long as HSYNC
is high. Figure 9 and Figure 10 depict the gated clock mode timings of CSI, and Table 21 lists the timing
parameters.
SI3
Host interface signal capacitance at the host
connector
Chost
—20
pF
Note: SRISE and SFALL meets this requirement when measured at the sender’s connector from 10–90% of full signal
amplitude with all capacitive loads from 15 pf through 40 pf where all signals have the same capacitive load value.
Table 20. AC Characteristics of All Interface Signals (continued)
ID
Parameter
Symbol
Min
Max
Unit
ATA Interface Signals
SI1
SI2
相关PDF资料
PDF描述
MCIMX31CVMN4DR2 IC MPU I.MX31 AUTO 473MAPBGA
MCIMX31DVMN5D IC MPU I.MX31 CONSUMR 473MAPBGA
MCIMX31VMN5CR2 IC MPU MAP I.MX31L 473-MAPBGA
MCIMX353CJQ5CR2 MULTIMEDIA PROCESSOR 400-MAPBGA
MCIMX356AJM5BR2 IC MPU IMX35 ARM11 400MAPBGA
相关代理商/技术参数
参数描述
MCIMX27MOP4AR2 功能描述:处理器 - 专门应用 BONO 19X19 R2 RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432
MCIMX27PDKCPU 功能描述:开发板和工具包 - ARM I.MX27 PDK CPU BOARD RoHS:否 制造商:Arduino 产品:Development Boards 工具用于评估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口类型:DAC, ICSP, JTAG, UART, USB 工作电源电压:3.3 V
MCIMX27V0P4A 制造商:Rochester Electronics LLC 功能描述: 制造商:Freescale Semiconductor 功能描述:
MCIMX27VJP4A 功能描述:处理器 - 专门应用 BONO 17X17 FG RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432
MCIMX27VJP4A 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 400MHZ MAPBGA-404