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| 型号： | MCP1601T-I/MS |
| 厂商： | Microchip Technology |
| 文件页数： | 15/22页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 0.5A 8MSOP |
| 标准包装： | 2,500 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 0.9 V ~ 5.5 V |
| 输入电压： | 2.7 V ~ 5.5 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 750kHz |
| 电流 - 输出： | 500mA |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 8-MSOP |
| 配用： | MCP1601EV-ND - BOARD EVALUATION FOR MCP1601 |
MCP1601
TABLE 5-4:
INDUCTOR SUPPLIERS
Supplier
Sumida ?
Sumida ?
Sumida ?
CT*
L
10 μH
10 μH
10 μH
10 μH
Type
Unshielded
Shielded
Shielded
Shielded
Area (mm)
4.1 mm x 3.8 mm
4.0 mm x 4.0 mm
5.7 mm x 5.7 mm
7.3 mm x 7.3 mm
Height
(mm)
3.0 mm
1.8 mm
3.0 mm
3.5 mm
DC
Resistance
230 M ?
160 M ?
65 M ?
70 M ?
Max.
Current
0.76A
0.66A
1.3A
1.7A
Series
C32
CDRH3D16
CDRH5D28
CTCDRH73
Coilcraft
?
10 μH
Shielded
6.6 mm x 4.5 mm
3.0 mm
75 M ?
1.0A
DS1608
Coilcraft ?
15 μH
Shielded
6.6 mm x 4.5 mm
3.0 mm
90 M ?
0.8A
DS1608
Coilcraft
?
22 μH
Shielded
6.6 mm x 4.5 mm
3.0 mm
110 M ?
0.7A
DS1608
Coilcraft ?
10 μH
Unshielded
6.0 mm x 5.4 mm
1.3 mm
300 M ?
0.60A
LPO6013
Wafer
Coilcraft ?
15 μH
Unshielded
6.0 mm x 5.4 mm
1.3 mm
380 M ?
0.55A
LPO6013
Wafer
Taiyo
10 μH
Shielded
5.0 mm x 5.0 mm
2.0 mm
66 M ?
0.7A
NP04SB100M
Yuden ?
Note:
CT* = Central Technologies
5.5
Efficiency
5.6
Printed Circuit Board Layout
Efficiency will be affected by the external component
selection and the specific operating conditions for the
application. In Section 2.0, “ Typical Performance
Curves ” , there are curves plotted using typical induc-
tors that can be used to estimate the converter
efficiency for 1.2V, 1.8V and 3.3V.
The MCP1601 is capable of switching over 500 mA at
750 kHz. As with all high-frequency, switch mode,
power supplies, a good board layout is essential to pre-
venting the noise generated by the power train switch-
ing from interfering with the sensing circuitry. The
MCP1601 has not demonstrated a sensitivity to layout,
but good design practice will prevent undesired results.
MCP1601
C IN
C OUT
P GND
A GND
C 1
R 2
P GND
R 1
SILK
FIGURE 5-2:
A GND
Component Placement.
When designing a board layout for the MCP1601, the
first thing to consider is the physical placement of the
external components. In Figure 5-2, SM0805 10 μF
ceramic capacitors are used for C IN and C OUT . The
SM0603 package is used for R 1 , R 2 and C 1 . The induc-
tor used is the Coilcraft ? LPO2506 series low profile
(0.047 ” high). The board outline in this example is 1 ” x
1 ” . C IN , L and C OUT are positioned around the
MCP1601 to make the high current paths as short as
possible.
? 2003 Microchip Technology Inc.
DS21762A-page 15
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| MCP1602-120I/MF | 功能描述:开关变换器、稳压器与控制器 20MHz 05A Synch-Buck PFM/PWM Reg RoHS:否 制造商:Texas Instruments 输出电压:1.2 V to 10 V 输出电流:300 mA 输出功率: 输入电压:3 V to 17 V 开关频率:1 MHz 工作温度范围: 安装风格:SMD/SMT 封装 / 箱体:WSON-8 封装:Reel |
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