参数资料
型号: MCP1601T-I/MS
厂商: Microchip Technology
文件页数: 16/22页
文件大小: 0K
描述: IC REG BUCK SYNC ADJ 0.5A 8MSOP
标准包装: 2,500
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 0.9 V ~ 5.5 V
输入电压: 2.7 V ~ 5.5 V
PWM 型: 电压模式
频率 - 开关: 750kHz
电流 - 输出: 500mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
包装: 带卷 (TR)
供应商设备封装: 8-MSOP
配用: MCP1601EV-ND - BOARD EVALUATION FOR MCP1601
MCP1601
MCP1601
P GND
BOT
A GND
A GND
P GND
FIGURE 5-3:
Top Layer.
FIGURE 5-4:
Bottom Layer.
The top layer of the board layout is shown in
Figure 5-3. The power conversion process is made up
of two types of circuits. One circuit carries changing
large signals (current, voltage), like C IN , C OUT , L and
the V IN , L X P GND pins of the MCP1601. The other cir-
cuitry is much smaller in signal and is used to sense,
regulate and control the high-power circuitry. These
components are R 1 , R 2 , C 1 and pins FB, A GND . The top
layer is partitioned so that the larger signal connections
are short and wide, while the smaller signals are routed
away from the large signals.
The MCP1601 utilizes two ground pins to separate the
large signal ground current from the small signal circuit
ground. The large signal ( “ Power Ground ” ) is labeled
“ P GND ” . The small signal is labeled “ Analog Ground ” or
“ A GND ” . In Figure 5-3, the P GND and the A GND are kept
separate on the top layer.
DS21762A-page 16
In Figure 5-4, the bottom layer is a partitioned ground
plane that connects A GND to P GND near the input
capacitor. The large signal current will circulate on the
top P GND partition. The lower partition is used for a
“ quiet ” ground, where A GND is connected.
? 2003 Microchip Technology Inc.
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