参数资料
型号: MCP16323T-500E/NG
厂商: Microchip Technology
文件页数: 14/32页
文件大小: 0K
描述: IC REG BUCK SYNC 5V 3A 16-VQFN
标准包装: 1
类型: 降压(降压)
输出类型: 固定
输出数: 1
输出电压: 5V
输入电压: 6 V ~ 18 V
PWM 型: 电流模式
频率 - 开关: 1MHz
电流 - 输出: 3A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-VFQFN 裸露焊盘
包装: 标准包装
供应商设备封装: 16-QFN(3x3)
其它名称: MCP16323T-500E/NGDKR
MCP16323
3.6
Enable Pin (EN)
The EN input pin is a logic-level input used to enable or
disable the device. A logic high (> 2.2V) will enable the
regulator output, while a logic low (< 0.8V) will ensure
that the regulator is disabled. This pin is internally
pulled up to an internal reference and will be enabled
when V IN > UVLO, unless the EN pin is pulled low. The
maximum input voltage applied to the EN pin should
not exceed 6V.
3.7
BOOST Pin (BOOST)
This pin will provide the bootstrap voltage required for
driving the upper internal NMOS switch of the buck
regulator. An external ceramic capacitor placed
between the BOOST input pin and the SW pin will
provide the necessary drive voltage for the upper
switch. During steady state operation, the capacitor is
recharged on every low-side, synchronous switching
cycle. If the Switch mode approaches 100% duty cycle
for the high-side MOSFET, the device will automatically
reduce the duty cycle switch to a minimum off time of
240 ns on every 8 th cycle to recharge the boost
capacitor.
3.8
Power Ground Pin (P GND )
This is a separate ground connection used for the low-
side synchronous switch to isolate switching noise from
the rest of the device.
3.9
Exposed Thermal Pad (EP)
There is no internal electrical connection between the
Exposed Thermal Pad (EP) and the P GND and S GND
pins. The EP must be connected to GND on the Printed
Circuit Board (PCB).
DS22284A-page 14
? 2011 Microchip Technology Inc.
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