参数资料
型号: MCP1790-5002E/DB
厂商: Microchip Technology
文件页数: 18/34页
文件大小: 0K
描述: IC REG LDO 5V 70MA SOT-223-3
标准包装: 78
稳压器拓扑结构: 正,固定式
输出电压: 5V
输入电压: 6 V ~ 30 V
电压 - 压降(标准): 0.7V @ 70mA
稳压器数量: 1
电流 - 输出: 70mA(最小)
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: TO-261-4,TO-261AA
供应商设备封装: SOT-223-3
包装: 管件
MCP1790/MCP1791
5.0
APPLICATION CIRCUITS/
ISSUES
EQUATION 5-2:
T J ( MAX ) = P TOTAL × R θ JA + T AMAX
5.1 Typical Application
The MCP1790/MCP1791 is most commonly used as a
voltage regulator. It is a high voltage input capability
and thermal protection make it ideal for automotive and
24V industrial applications.
T J(MAX)
P TOTAL
R θ JA
T AMAX
=
=
=
=
Maximum continuous junction
temperature
Total device power dissipation
Thermal resistance from junction
to ambient
Maximum ambient temperature
MCP1791
The maximum power dissipation capability for a
package can be calculated given the junction-to-
C OUT
V IN
24 VDC
5
1
1N4002
C IN
1 μF
Ceramic
2
+
3
4 5
PWRGD
10 k Ω V OUT
+
5V@70 mA
4.7 μF Ceramic
ambient thermal resistance and the maximum ambient
temperature for the application. The following equation
can be used to determine the package maximum
internal power dissipation.
EQUATION 5-3:
( T J ( MAX ) – T A ( MAX ) )
P D ( MAX ) = ---------------------------------------------------
FIGURE 5-1: Typical Application.
5.1.1 APPLICATION INPUT CONDITIONS
Package Type = SOT-223-5
Input Voltage Range = 8V to 24V
P D(MAX)
T J(MAX)
R θ JA
= Maximum device power
dissipation
= Maximum continuous junction
temperature
V IN maximum = 24V
V OUT typical = 5.0V
I OUT = 70 mA maximum
T A(MAX)
R θ JA
=
=
Maximum ambient temperature
Thermal resistance from junction
to ambient
5.2 Power Calculations
5.2.1 POWER DISSIPATION
The internal power dissipation of the MCP1790/
MCP1791 is a function of input voltage, output voltage
and output current. The power dissipation, as a result
of the quiescent current draw, is so low, it is
EQUATION 5-4:
T J ( RISE ) = P TOTAL × R θ JA
T J(RISE) = Rise in device junction
temperature over the ambient
temperature
insignificant (70.0 μA x V IN ). The following equation
can be used to calculate the internal power dissipation
of the LDO.
P TOTAL
R θ JA
=
=
Total device power dissipation
Thermal resistance from
junction-to-ambient
EQUATION 5-1:
P LDO = ( V IN ( MAX ) ) – V OUT ( MIN ) ) × I OUT ( MAX ) )
P LDO = LDO Pass device internal power
dissipation
EQUATION 5-5:
T J = T J ( RISE ) + T A
V IN(MAX)
V OUT(MIN)
=
=
Maximum input voltage
LDO minimum output voltage
T J
T J(RISE)
=
=
Junction Temperature
Rise in device junction
temperature over the ambient
The maximum continuous operating junction
temperature
temperature specified for the MCP1790/MCP1791 is
+125 ° C . To estimate the internal junction temperature
T A
=
Ambient temperature
of the MCP1790/MCP1791, the total internal power
dissipation is multiplied by the thermal resistance from
junction to ambient (R θ JA ). The thermal resistance
from junction to ambient for the SOT-223-5 package is
estimated at 62 ° C/W.
DS22075B-page 18
? 2010 Microchip Technology Inc.
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