参数资料
型号: MCP1790-5002E/DB
厂商: Microchip Technology
文件页数: 6/34页
文件大小: 0K
描述: IC REG LDO 5V 70MA SOT-223-3
标准包装: 78
稳压器拓扑结构: 正,固定式
输出电压: 5V
输入电压: 6 V ~ 30 V
电压 - 压降(标准): 0.7V @ 70mA
稳压器数量: 1
电流 - 输出: 70mA(最小)
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: TO-261-4,TO-261AA
供应商设备封装: SOT-223-3
包装: 管件
MCP1790/MCP1791
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, V IN = V OUT(MAX) + V DROPOUT(MAX), (Note 1) , I OUT = 1 mA,
C OUT = 4.7 μF (X7R Ceramic), C IN = 4.7 μF (X7R Ceramic), T A = +25°C, SHDN > 2.4V.
Boldface type applies for junction temperatures, T J (Note 5) of -40°C to +125°C.
Parameters
Detect Threshold to PWRGD Active
Time Delay
Symbol
TV DET-PWRG
D
Min
Typ
235
Max
Units
μs
Conditions
V OUT = V PWRGD_TH +
100 mV to V PWRGD_TH -
100 mV
AC Performance
Output Delay from SHDN
PWRGD Delay from SHDN
Output Noise
T OR
T SHDN_PG
e N
200
400
1.2
μs
ns
(μV/ √ Hz)
SHDN = GND to V IN,
V OUT = GND to 95% V R,
C OUT = 1.0 μF
SHDN = V IN to GND ,
C OUT = 1.0 μF
I OUT = 50 mA, f = 1 kHz
Power Supply Ripple Rejection Ratio
PSRR
dB
V IN = 7.0V, C IN = 0 μF,
I OUT = 10 mA,
V INAC = 400 mVpp
90
75
80
f = 100 Hz
f = 1 kHz, V R = 5.0V
f = 1 kHz, V R = < 5.0V
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
Short Circuit Recovery Time
T SD
Δ T SD
t THERM
157
20
0
°C
°C
ms
Rising Temperature
Falling Temperature
Note 1:
2:
3:
4:
5:
6:
7:
8:
9:
The minimum V IN , V IN(MIN) must meet two conditions: V IN ≥ 6.0 V and V IN ≥ V OUT(MAX) + V DROPOUT(MAX).
V R is the nominal regulator output voltage.
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., T A , T J , θ JA ). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 165°C rating. Sustained
junction temperatures above 165°C can impact the device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of V IN = V R + V DROPOUT( MAX ) .
Sustained junction temperatures above 165°C can impact the device reliability.
The Short Circuit Recovery Time test is done by placing the device into a short circuit condition and then removing the
short circuit condition before the device die temperature reaches 125 °C. If the device goes into thermal shutdown, then
the Short Circuit Recovery Time will depend upon the thermal dissipation properties of the package and circuit board.
TCV OUT = (V OUT-HIGH - V OUT-LOW ) *10^6/(V R * Δ Temperature), V OUT-HIGH = highest voltage measured over the temperature
range. V OUT-LOW = lowest voltage measured over the temperature range.
DS22075B-page 6
? 2010 Microchip Technology Inc.
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