参数资料
型号: MCP23S18T-E/SP
元件分类: 微控制器/微处理器
英文描述: PIA-GENERAL PURPOSE, PDIP28
封装: 0.300 INCH, PLASTIC, SPDIP-28
文件页数: 38/56页
文件大小: 738K
代理商: MCP23S18T-E/SP
2008 Microchip Technology Inc.
DS22103A-page 43
MCP23018/MCP23S18
3.0
PACKAGING INFORMATION
3.1
Package Marking Information
Legend: XX...X
Customer-specific information
Y
Year code (last digit of calendar year)
YY
Year code (last 2 digits of calendar year)
WW
Week code (week of January 1 is week ‘01’)
NNN
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
)
can be found on the outer packaging for this package.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
24-Lead SSOP (MCP23018 only)
Example:
XXXXXXXXXXXX
YYWWNNN
24-Lead QFN
Example
XXXXX
XXXXXX
YWWNNN
23018
E/MJ^^
0838
256
3
e
MCP23018
E/SS^^
0838256
3
e
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