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| 型号： | MCP3304T-CI/SL |
| 厂商： | Microchip Technology |
| 文件页数： | 14/48页 |
| 文件大小： | 0K |
| 描述： | IC ADC 13BIT 2.7V 4CH SPI 16SOIC |
| 标准包装： | 2,600 |
| 位数： | 13 |
| 采样率（每秒）： | 100k |
| 数据接口： | 串行，SPI? |
| 转换器数目： | 1 |
| 电压电源： | 单电源 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-SOIC |
| 包装： | 带卷 (TR) |
| 输入数目和类型： | 8 个单端，单极；4 个差分，单极 |
| 其它名称： | MCP3304TCI/SL |
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2011 Microchip Technology Inc.
DS21697F-page 21
MCP3302/04
5.7
Utilizing the Digital and Analog
Ground Pins
The MCP3302/04 devices provide both digital and
analog ground connections to provide another means
of noise reduction. As shown in Figure 5-11, the analog
and digital circuitry are separated internal to the device.
This reduces noise from the digital portion of the device
being coupled into the analog portion of the device. The
two grounds are connected internally through the
substrate which has a resistance of 5 -10.
If no ground plane is utilized, then both grounds must
be connected to VSS on the board. If a ground plane is
available, both digital and analog ground pins should
be connected to the analog ground plane. If both an
analog and a digital ground plane are available, both
the digital and the analog ground pins should be
connected to the analog ground plane, as shown in
Figure 5-11. Following these steps will reduce the
amount of digital noise from the rest of the board being
coupled into the A/D Converter.
FIGURE 5-11:
Separation of Analog and
Digital Ground Pins.MCP3302/04.
MCP3302/04
Analog Ground Plane
DGND
AGND
VDD
0.1 F
Substrate
5 - 10
Digital Side
-SPI Interface
-Shift Register
-Control Logic
Analog Side
-Sample Cap
-Capacitor Array
-Comparator
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| MCP3304TI/P | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:13-Bit Differential Input, Low Power A/D Converter with SPI Serial Interface |
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