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| 型号： | MCP47DA1T-A0E/OT |
| 厂商： | Microchip Technology |
| 文件页数： | 23/54页 |
| 文件大小： | 0K |
| 描述： | IC DGTL POT 30K 1CH SOT-23-6 |
| 标准包装： | 1 |
| 接片： | 65 |
| 电阻（欧姆）： | 30k |
| 电路数： | 1 |
| 温度系数： | 标准值 150 ppm/°C |
| 存储器类型： | 易失 |
| 接口： | I²C |
| 电源电压： | 1.8 V ~ 5.5 V，2.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-6 |
| 供应商设备封装： | SOT-23-6 |
| 包装： | 标准包装 |
| 其它名称： | MCP47DA1T-A0E/OTDKR |
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2012 Microchip Technology Inc.
DS25118C-page 3
MCP47DA1
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Voltage on VDD with respect to VSS ......................................................................................................... 0.6V to +7.0V
Voltage on SCL, and SDA with respect to VSS ..................................................................................................... -0.6V to VDD + 0.3V
Voltage on all other pins (VOUT and VREF) with respect to VSS ..................................................................... -0.3V to VDD + 0.3V
Input clamp current, IIK (VI < 0, VI > VDD) .............................................................................................................±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD)...................................................................................................±20 mA
Maximum output current sunk by any Output pin ................................................................................................... 25 mA
Maximum output current sourced by any Output pin ............................................................................................. 25 mA
Maximum current out of VSS pin ...........................................................................................................................100 mA
Maximum current into VDD pin ..............................................................................................................................100 mA
Maximum current into VREF pin..............................................................................................................................250 uA
Maximum current sourced by VOUT pin ..................................................................................................................40 mA
Maximum current sunk by VREF pin ........................................................................................................................40 mA
Package power dissipation (TA = +50°C, TJ = +150°C)
SOT-23-6...................................................................................................................................................525 mW
SC70-6 ...................................................................................................................................................... 480 mW
Storage temperature ............................................................................................................................... -65°C to +150°C
Ambient temperature with power applied ............................................................................................... -40°C to +125°C
ESD protection on all pins
6 kV (HBM)
400V (MM)
2kV (CDM)
Latch-up (JEDEC JESD78A) at +125°C ............................................................................................................. ±100 mA
Soldering temperature of leads (10 seconds) ....................................................................................................... +300°C
Maximum Junction Temperature (TJ) ................................................................................................................... +150°C
Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
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