参数资料
型号: MCP629T-E/ML
厂商: Microchip Technology
文件页数: 15/66页
文件大小: 0K
描述: IC OPAMP GP RR 20MHZ W/CS 16QFN
标准包装: 3,300
系列: mCal 技术
放大器类型: 通用
电路数: 2
输出类型: 满摆幅
转换速率: 10 V/µs
增益带宽积: 20MHz
电流 - 输入偏压: 5pA
电压 - 输入偏移: 200µV
电流 - 电源: 2.5mA
电流 - 输出 / 通道: 70mA
电压 - 电源,单路/双路(±): 2.5 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-VQFN 裸露焊盘
供应商设备封装: 16-QFN(4x4)
包装: 带卷 (TR)
MCP621/1S/2/3/4/5/9
DS22188C-page 22
2009-2011 Microchip Technology Inc.
3.1
Analog Outputs
The analog output pins (VOUT) are low-impedance
voltage sources.
3.2
Analog Inputs
The non-inverting and inverting inputs (VIN+, VIN–, …)
are high-impedance CMOS inputs with low bias
currents.
3.3
Power Supply Pins
The positive power supply (VDD) is 2.5V to 5.5V higher
than the negative power supply (VSS). For normal
operation, the other pins are between VSS and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need bypass capacitors.
3.4
Calibration Common Mode
Voltage Input
A low-impedance voltage placed at this input (VCAL)
will set the op amps’ Common mode input voltage
during calibration. If this pin is left open, the Common
mode input voltage during calibration is approximately
VDD/3. The internal resistor divider is disconnected
from the supplies whenever the part is not in
calibration.
3.5
Calibrate/Chip Select Digital Input
This input (CAL/CS, …) is a CMOS, Schmitt-triggered
input that affects the calibration and Low-Power modes
of operation. When this pin goes high, the part is placed
into a Low-Power mode and the output is high-Z. When
this pin goes low, a calibration sequence is started
(which corrects VOS). At the end of the calibration
sequence, the output becomes low-impedance and the
part resumes normal operation.
An internal POR triggers a calibration event when the
part is powered on, or when the supply voltage drops
too low. Thus, the MCP622 parts are calibrated, even
though they do not have a CAL/CS pin.
3.6
Exposed Thermal Pad (EP)
There is an internal connection between the Exposed
Thermal Pad (EP) and the VSS pin; they must be
connected to the same potential on the Printed Circuit
Board (PCB).
This pad can be connected to a PCB ground plane to
provide a larger heat sink. This improves the package
thermal resistance (
θJA).
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