参数资料
型号: MCP6H01T-E/OT
厂商: Microchip Technology
文件页数: 7/46页
文件大小: 0K
描述: IC OP AMP 16V 1.2MHZ SGL SOT23-5
标准包装: 3,000
放大器类型: 通用
电路数: 1
输出类型: 满摆幅
转换速率: 0.8 V/µs
增益带宽积: 1.2MHz
电流 - 输入偏压: 10pA
电压 - 输入偏移: 700µV
电流 - 电源: 135µA
电流 - 输出 / 通道: 50mA
电压 - 电源,单路/双路(±): 3.5 V ~ 16 V,±1.75 V ~ 8 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: SC-74A,SOT-753
供应商设备封装: SOT-23-5
包装: 带卷 (TR)
其它名称: MCP6H01T-E/OTTR
2010-2011 Microchip Technology Inc.
DS22243D-page 15
MCP6H01/2/4
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
3.1
Analog Outputs
The output pins are low-impedance voltage sources.
3.2
Analog Inputs
The
non-inverting
and
inverting
inputs
are
high-impedance CMOS inputs with low bias currents.
3.3
Power Supply Pins
The positive power supply (VDD) is 3.5V to 16V higher
than the negative power supply (VSS). For normal
operation, the other pins are at voltages between VSS
and VDD.
Typically, these parts can be used in single-supply
operation or dual-supply operation. Also, VDD will need
bypass capacitors.
3.4
Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the VSS pin; they must
be connected to the same potential on the Printed
Circuit Board (PCB).
MCP6H01
MCP6H02
MCP6H04
Symbol
Description
SC70-5,
SOT-23-5
SOIC
2x3 TDFNSOIC2x3 TDFN
SOIC,
TSSOP
166
1
VOUT, VOUTA Analog Output (op amp A)
422
2
VIN–, VINA
Inverting Input (op amp A)
333
3
VIN+, VINA+
Non-inverting Input (op amp A)
577
8
4
VDD
Positive Power Supply
——
5
VINB+
Non-inverting Input (op amp B)
——
6
VINB
Inverting Input (op amp B)
——
7
VOUTB
Analog Output (op amp B)
———
8
VOUTC
Analog Output (op amp C)
———
9
VINC
Inverting Input (op amp C)
———
10
VINC+
Non-inverting Input (op amp C)
244
4
11
VSS
Negative Power Supply
———
12
VIND+
Non-inverting Input (op amp D)
———
13
VIND
Inverting Input (op amp D)
———
14
VOUTD
Analog Output (op amp D)
1, 5, 8
NC
No Internal Connection
9
9
EP
Exposed Thermal Pad (EP); must
be connected to VSS.
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