参数资料
型号: MCZ33784EF
厂商: Freescale Semiconductor
文件页数: 25/30页
文件大小: 0K
描述: IC SENSOR DBUS DSI 2.02 16-SOIC
标准包装: 48
类型: 传感器接口
输入类型: 模拟
输出类型: 数字
接口: 总线
电流 - 电源: 4mA
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.154",3.90mm 宽)
供应商设备封装: 16-SOIC N
包装: 管件
Analog Integrated Circuit Device Data
4
Freescale Semiconductor
33784
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to Analog Ground (AGND) unless otherwise noted. Exceeding these ratings may cause a
malfunction or permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
I/O0, I/O1, I/O2, AN0, AN1, TEST1, TEST2, TOUT Voltage
VIO
-0.3 to VREGOUT + 0.3
V
I/On, ANn, TESTn, TOUT Pin Current
IIO
5.0
mA
BUSOUT Voltage, BUS SW = open
VIN
-14 to 40
V
BUSIN Voltage, BUS SW = open
VIN
-0.3 to 40
V
RTNOUT Voltage, BUS SW = open
VIN
-14 to 25
V
H_CAP Voltage
VIN
-0.3 to 40
V
BUSIN, BUSOUT, and H_CAP Current (Continuous)
IIN
400
mA
BUSIN, RTNIN, reverse current (max 5 ms)
IREVLK
400
mA
RTNIN, RTNOUT Current
IBUSRTN
400
mA
IDDQ Voltage
VIDDQ
2.75
V
VREG Range
VRO
0.3 - 7.0
V
Human Body Model (HBM)
Machine Model (MM)
Charge Device Model (CDM)
Corner pins
All other pins
VESD
±2000
±200
±750
±500
V
THERMAL RATINGS
Storage Temperature
TS
-55 to 150
°C
Operating Ambient Temperature
TA
-40 to 125
°C
Operating Junction Temperature
TJ
-40 to 150
°C
THERMAL RESISTANCE AND PACKAGE DISSIPATION RATINGS
Resistance, Junction-to-Ambient (Single Layer (1s) PCB Board)
RθJA
125
°C/W
Resistance, Junction-to-Board (Multi-Layer (2s2P) PCB Board)
RθJB
62
°C/W
Peak Package Reflow Temperature During Reflow(2),(3)
TPPRT
°C
Notes
1.
ESD1 testing is performed in accordance with the Human Body Model (HBM) (C
ZAP= 100pF, RZAP=1500Ω), ESD2 testing is
performed in accordance with the Machine Model (MM) (CZAP=200pF, RZAP=0Ω); and Charge Body Model (CBM)
2.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
3.
相关PDF资料
PDF描述
VE-JNR-IZ-B1 CONVERTER MOD DC/DC 7.5V 25W
MCZ33793AEFR2 IC DSI SLAVE SENSOR 16-SOIC
MCZ33793AEF IC DSI SLAVE SENSOR 16-SOIC
VE-JNR-IY-F4 CONVERTER MOD DC/DC 7.5V 50W
MC908JB16JDWE IC MCU 16K FLASH 6MHZ USB 20SOIC
相关代理商/技术参数
参数描述
MCZ33784EF/R2- 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:DSI 2.02 Sensor Interface
MCZ33784EFR2 功能描述:加速计 - 板上安装 DBUS2 SENSOR INTERFACE RoHS:否 制造商:Murata 传感轴:Double 加速:12 g 灵敏度: 封装 / 箱体: 输出类型:Analog 数字输出 - 位数:11 bit 电源电压-最大:5.25 V 电源电压-最小:4.75 V 电源电流:4 mA 最大工作温度:+ 125 C 最小工作温度:- 40 C
MCZ33789AE 功能描述:网络控制器与处理器 IC Airbag ASSP RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流(最大值):595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
MCZ33789AE/R2 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Airbag System Basis Chip (SBC) with Power Supply and PSI5 Sensor Interface
MCZ33789AER2 功能描述:网络控制器与处理器 IC Airbag ASSP RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流(最大值):595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray