参数资料
型号: MCZ33812EK
厂商: Freescale Semiconductor
文件页数: 6/25页
文件大小: 0K
描述: IC DVR IGNITION/INJECTOR 32-SOIC
标准包装: 42
应用: 自动
电流 - 电源: 10mA
电源电压: 4.7 V ~ 36 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 32-BSOP(0.295",7.50mm 宽)裸露焊盘
供应商设备封装: 32-SOICW 裸露焊盘
包装: 管件
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground, unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
VPWR Supply Voltage (1)
Logic Input Voltage (MTX, INJIN, IGNIN, WDRFSH, LAMPIN, RIN)
Injector and RELAY Low Side Driver Drain Voltage (V INJOUT )
Lamp Low Side Driver Drain Voltage (LAMPOUT)
Output Clamp Energy (INJOUT and ROUT) (Single Pulse)
T JUNCTION = 150°C, I OUT = 1.5 A
Output Clamp Energy (INJOUT and ROUT) (Continuous operation)
T JUNCTION = 125°C, I OUT = 1.0 A, (Max. frequency is 70 Hz, Maximum Duty Cycle 90%)
Output Continuous Current (INJOUT and ROUT)
T JUNCTION = 150°C
Output Clamp Energy (LAMPOUT) (Single Pulse) - T JUNCTION = 150°C, I OUT = 0.5 A
ESD Voltage (2)
Human Body Model
Machine Model
Charge Device Model (Corner pins)
Charge Device Model
Symbol
V PWR
V IL
V INJOUT
V RELOUT
LAMP OUT
E CLAMP_INJ_SP
E CLAMP_REL_SP
E CLAMP_INJ_CP
E CLAMP_REL_CP
I OCC_MAX
E CLAMP_LAMP_SP
V ESD1
V ESD2
V ESD3
V ESD4
Value
-0.3 to 45
-0.3 to V CC
-0.3 to V CLAMP_INJ
-0.3 to V CLAMP_REL
-0.3 to V CLAMP_LAMP
100
100
2.0
35
±2000
±200
±750
±500
Unit
V DC
V DC
V DC
V DC
mJ
mJ
A
mJ
V
THERMAL RATINGS
Operating Temperature
° C
Ambient
Junction
Case
T A
T J
T C
-40 to 125
-40 to 150
-40 to 125
Storage Temperature
T STG
-55 to 150
° C
Power Dissipation (T A =
25 ° C) (5)
P D
1.7
W
Peak Package Reflow Temperature During Solder Mounting (3) , (4)
Thermal Resistance
Junction-to-Ambient
Junction- to-Lead
Junction-to-Flag
T SOLDER
R θ JA
R θ JL
R θ JC
Note 4
75
8.0
1.2
° C
° C/W
Notes
1. Exceeding these limits may cause malfunction or permanent damage to the device.
2. ESD testing is performed in accordance with the Human Body Model (HBM) (C ZAP = 100 pF, R ZAP = 1500 Ω ), the Machine Model (MM)
(C ZAP = 200 pF, R ZAP = 0 Ω ), and the Charge Device Model (CDM), Robotic (C ZAP = 4.0 pF).
3.
5.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
This parameter is guaranteed by design but is not production tested.
33812
Analog Integrated Circuit Device Data
6
Freescale Semiconductor
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