- 您现在的位置：买卖IC网 > PDF目录69033 > MK30N512VML100 (FREESCALE SEMICONDUCTOR INC) RISC MICROCONTROLLER, PBGA104 PDF资料下载
参数资料
| 型号： | MK30N512VML100 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | RISC MICROCONTROLLER, PBGA104 |
| 封装： | 8 X 8 MM, MAPBGA-104 |
| 文件页数： | 11/60页 |
| 文件大小： | 877K |
| 代理商： | MK30N512VML100 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页当前第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页
5.3.1 Thermal operating requirements
Table 9. Thermal operating requirements
Symbol
Description
Min.
Max.
Unit
TJ
Die junction temperature
–40
125
°C
TA
Ambient temperature
–40
105
°C
5.3.2 Thermal attributes
Board
type
Symbol
Description
104
MAPBGA
100
LQFP
Unit
Notes
Single-
layer (1s)
RθJA
Thermal resistance, junction to ambient (natural
convection)
TBD
°C/W
Four-layer
(2s2p)
RθJA
Thermal resistance, junction to ambient (natural
convection)
TBD
°C/W
Single-
layer (1s)
RθJMA
Thermal resistance, junction to ambient (200 ft./
min. air speed)
TBD
°C/W
Four-layer
(2s2p)
RθJMA
Thermal resistance, junction to ambient (200 ft./
min. air speed)
TBD
°C/W
—
RθJB
Thermal resistance, junction to board
TBD
°C/W
—
RθJC
Thermal resistance, junction to case
TBD
°C/W
—
ΨJT
Thermal characterization parameter, junction to
package top outside center (natural convection)
TBD
°C/W
6 Peripheral operating requirements and behaviors
6.1 Core modules
1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions
—Junction-to-Board.
3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material between
the top of the package and the cold plate.
4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
Peripheral operating requirements and behaviors
K30 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
19
Preliminary
相关PDF资料 |
PDF描述 |
|---|---|
| MK40N512VLL100 | 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP100 |
| MK40N512VLL100R | 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP100 |
| MK40N512VMD100R | 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA144 |
| MK40N512VLQ100 | 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP144 |
| MK40N512VMD100 | 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA144 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MK30R1F | 制造商:Ohmite Mfg Co 功能描述: |
| MK30X128VLQ100 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:K30 Sub-Family Data Sheet |
| MK30X128VMD100 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:K30 Sub-Family Data Sheet |
| MK30X256VLQ100 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:K30 Sub-Family Data Sheet |
| MK30X256VMD100 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:K30 Sub-Family Data Sheet |
发布紧急采购，3分钟左右您将得到回复。