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参数资料
| 型号： | MK53DX256ZCMD10R |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA144 |
| 封装： | 13 X 13 MM, MAPBGA-144 |
| 文件页数： | 28/82页 |
| 文件大小： | 1124K |
| 代理商： | MK53DX256ZCMD10R |
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6.3.3.2 32kHz oscillator frequency specifications
Table 19. 32kHz oscillator frequency specifications
Symbol
Description
Min.
Typ.
Max.
Unit
Notes
fosc_lo
Oscillator crystal
—
32.768
—
kHz
tstart
Crystal start-up time
—
1000
—
ms
1. Proper PC board layout procedures must be followed to achieve specifications.
6.4 Memories and memory interfaces
6.4.1 Flash (FTFL) electrical specifications
This section describes the electrical characteristics of the FTFL module.
6.4.1.1 Flash timing specifications — program and erase
The following specifications represent the amount of time the internal charge pumps are
active and do not include command overhead.
Table 20. NVM program/erase timing specifications
Symbol
Description
Min.
Typ.
Max.
Unit
Notes
thvpgm4
Longword Program high-voltage time
—
20
TBD
μs
thversscr
Sector Erase high-voltage time
—
20
100
ms
thversblk256k Erase Block high-voltage time for 256 KB
—
160
800
ms
1. Maximum time based on expectations at cycling end-of-life.
6.4.1.2 Flash timing specifications — commands
Table 21. Flash command timing specifications
Symbol
Description
Min.
Typ.
Max.
Unit
Notes
trd1blk256k
Read 1s Block execution time
256 KB data flash
—
1.4
ms
trd1sec2k
Read 1s Section execution time (flash sector)
—
40
μs
tpgmchk
Program Check execution time
—
35
μs
trdrsrc
Read Resource execution time
—
35
μs
tpgm4
Program Longword execution time
—
50
TBD
μs
Table continues on the next page...
Peripheral operating requirements and behaviors
K53 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
34
Preliminary
Freescale Semiconductor, Inc.
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