参数资料
型号: MMDF2C03HDR2
厂商: ON Semiconductor
文件页数: 2/10页
文件大小: 0K
描述: MOSFET N+P 30V 3A 8-SOIC
产品变化通告: LTB Notification 03/Jan/2008
标准包装: 10
FET 型: N 和 P 沟道
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 4.1A,3A
开态Rds(最大)@ Id, Vgs @ 25° C: 70 毫欧 @ 3A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 16nC @ 10V
输入电容 (Ciss) @ Vds: 630pF @ 24V
功率 - 最大: 2W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 剪切带 (CT)
其它名称: MMDF2C03HDR2OSCT
MMDF2C03HD
ELECTRICAL CHARACTERISTICS (T A = 25 ° C unless otherwis      e noted) (Note 3)
Characteristic
Symbol
Polarity
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain ? Source Breakdown Voltage
(V GS = 0 Vdc, I D = 250 m Adc)
Zero Gate Voltage Drain Current
(V DS = 30 Vdc, V GS = 0 Vdc)
Gate ? Body Leakage Current (V GS = ± 20 Vdc, V DS = 0)
V (BR)DSS
I DSS
I GSS
?
(N)
(P)
?
30
?
?
?
?
?
?
?
?
1.0
1.0
100
Vdc
m Adc
nAdc
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
(V DS = V GS , I D = 250 m Adc)
Drain ? to ? Source On ? Resistance
(V GS = 10 Vdc, I D = 3.0 Adc)
(V GS = 10 Vdc, I D = 2.0 Adc)
Drain ? to ? Source On ? Resistance
(V GS = 4.5 Vdc, I D = 1.5 Adc)
(V GS = 4.5 Vdc, I D = 1.0 Adc)
Forward Transconductance
(V DS = 3.0 Vdc, I D = 1.5 Adc)
(V DS = 3.0 Vdc, I D = 1.0 Adc)
V GS(th)
R DS(on)
R DS(on)
g FS
(N)
(P)
(N)
(P)
(N)
(P)
(N)
(P)
1.0
1.0
?
?
?
?
2.0
2.0
1.7
1.5
0.06
0.17
0.065
0.225
3.6
3.4
3.0
2.0
0.070
0.200
0.075
0.300
?
?
Vdc
W
W
mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
C iss
(N)
(P)
?
?
450
397
630
550
pF
Output Capacitance
Transfer Capacitance
(V DS = 24 Vdc, V GS = 0 Vdc,
f = 1.0 MHz)
C oss
C rss
(N)
(P)
(N)
(P)
?
?
?
?
160
189
35
64
225
250
70
126
SWITCHING CHARACTERISTICS (Note 5)
Turn ? On Delay Time
t d(on)
(N)
(P)
?
?
12
16
24
32
ns
Rise Time
Turn ? Off Delay Time
Fall Time
Turn ? On Delay Time
Rise Time
Turn ? Off Delay Time
Fall Time
(V DD = 15 Vdc, I D = 3.0 Adc,
V GS = 4.5 Vdc, R G = 9.1 W )
(V DD = 15 Vdc, I D = 2.0 Adc,
V GS = 4.5 Vdc, R G = 6.0 W )
(V DD = 15 Vdc, I D = 3.0 Adc,
V GS = 10 Vdc, R G = 9.1 W )
(V DD = 15 Vdc, I D = 2.0 Adc,
V GS = 10 Vdc, R G = 6.0 W )
t r
t d(off)
t f
t d(on)
t r
t d(off)
t f
(N)
(P)
(N)
(P)
(N)
(P)
(N)
(P)
(N)
(P)
(N)
(P)
(N)
(P)
?
?
?
?
?
?
?
?
?
?
?
?
?
?
65
18
16
63
19
194
8.0
9.0
15
10
30
81
23
192
130
36
32
126
38
390
16
18
30
20
60
162
46
384
Total Gate Charge
Q T
(N)
(P)
?
?
11.5
14.2
16
19
nC
Gate ? Source Charge
Gate ? Drain Charge
(V DS = 10 Vdc, I D = 3.0 Adc,
V GS = 10 Vdc)
(V DS = 24 Vdc, I D = 2.0 Adc,
V GS = 10 Vdc)
Q 1
Q 2
Q 3
(N)
(P)
(N)
(P)
(N)
(P)
?
?
?
?
?
?
1.5
1.1
3.5
4.5
2.8
3.5
?
?
?
?
?
?
3. Negative signs for P ? Channel device omitted for clarity.
4. Pulse Test: Pulse Width ≤ 300 m s, Duty Cycle ≤ 2%.
5. Switching characteristics are independent of operating junction temperature.
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