参数资料
型号: MMFT3055VLT1
厂商: ON SEMICONDUCTOR
元件分类: 小信号晶体管
英文描述: 1500 mA, 60 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-261AA
封装: CASE 318E-04, 4 PIN
文件页数: 6/10页
文件大小: 219K
代理商: MMFT3055VLT1
MMFT3055VL
http://onsemi.com
5
VDS
,DRAINT
OSOURCE
VOL
TAGE
(VOL
TS)
V GS
,GA
TETOSOURCE
VOL
TAGE
(VOL
TS)
DRAINTOSOURCE DIODE CHARACTERISTICS
0.6 0.625
0.675
0.775
VSD, SOURCETODRAIN VOLTAGE (VOLTS)
Figure 8. GateToSource and DrainToSource
Voltage versus Total Charge
I S
,SOURCE
CURRENT
(AMPS)
Figure 9. Resistive Switching Time
Variation versus Gate Resistance
RG, GATE RESISTANCE (OHMS)
1
10
100
t,TIME
(ns)
VDD = 30 V
ID = 1.5 A
VGS = 5 V
TJ = 25°C
tf
td(off)
VGS = 0 V
TJ = 25°C
0
QT, TOTAL CHARGE (nC)
23
4
5
ID = 1.5 A
TJ = 25°C
VGS
0
1.2
1.6
1000
100
10
1
10
6
2
0
1
8
4
30
27
24
21
18
15
0
VDS
6
0.8
0.65
0.7 0.725
0.4
0.75
QT
Q1
Q2
Q3
7
1
td(on)
tr
Figure 10. Diode Forward Voltage versus Current
7
3
9
5
12
3
6
9
1
1.4
0.6
0.2
0.8
89
10
0.825 0.85
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curves define
the maximum simultaneous draintosource voltage and
drain current that a transistor can handle safely when it is
forward biased. Curves are based upon maximum peak
junction temperature and a case temperature (TC) of 25°C.
Peak repetitive pulsed power limits are determined by using
the thermal response data in conjunction with the procedures
discussed
in
AN569,
“Transient
Thermal
ResistanceGeneral Data and Its Use.”
Switching between the offstate and the onstate may
traverse any load line provided neither rated peak current
(IDM) nor rated voltage (VDSS) is exceeded and the
transition time (tr,tf) do not exceed 10 μs. In addition the total
power averaged over a complete switching cycle must not
exceed (TJ(MAX) TC)/(RθJC).
A Power MOSFET designated EFET can be safely used
in switching circuits with unclamped inductive loads. For
reliable operation, the stored energy from circuit inductance
dissipated in the transistor while in avalanche must be less
than the rated limit and adjusted for operating conditions
differing from those specified. Although industry practice is
to rate in terms of energy, avalanche energy capability is not
a constant. The energy rating decreases nonlinearly with an
increase of peak current in avalanche and peak junction
temperature.
Although many EFETs can withstand the stress of
draintosource avalanche at currents up to rated pulsed
current (IDM), the energy rating is specified at rated
continuous current (ID), in accordance with industry
custom. The energy rating must be derated for temperature
as shown in the accompanying graph (Figure 13). Maximum
energy at currents below rated continuous ID can safely be
assumed to equal the values indicated.
相关PDF资料
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MMFT3055VLT3 1500 mA, 60 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-261AA
MMFT3055VLT1 1500 mA, 60 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-261AA
MMFT3055VT1G 1700 mA, 60 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-261AA
MMFT3055VT1 1700 mA, 60 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-261AA
MMFT3055VT1 1700 mA, 60 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-261AA
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