参数资料
型号: MOBILE AMD-K6-2
厂商: Advanced Micro Devices, Inc.
英文描述: 32 Bit Microprocessor With 64-Kbyte Level-one Cache and Advanced RISC86 Superscalar Microarchitecture(32位微处理器带64K字节高速缓存和高级的RISC86超标量微体系结构)
中文描述: 32位微处理器的64 -字节的一级缓存和高级RISC86超标微架构(32位微处理器带64K的字节高速缓存和高级的RISC86超标量微体系结构)
文件页数: 17/136页
文件大小: 2960K
代理商: MOBILE AMD-K6-2
Chapter 1
Mobile AMD-K6
-2 Processor
3
21896D/0—September 1999
Mobile AMD-K6
-2 Processor Data Sheet
Preliminary Information
1
Mobile AMD-K6
-2 Processor
I
Advanced 6-Issue RISC86
Superscalar Microarchitecture
Ten parallel specialized execution units
Multiple sophisticated x86-to-RISC86 instruction decoders
Advanced two-level branch prediction
Speculative execution
Out-of-order execution
Register renaming and data forwarding
Issues up to six RISC86 instructions per clock
Large On-Chip Split 64-Kbyte Level-One (L1) Cache
32-Kbyte instruction cache with additional predecode cache
32-Kbyte writeback dual-ported data cache
MESI protocol support
High-Performance IEEE 754-Compatible and 854-Compatible Floating-Point Unit
Superscalar MMX
unit supports industry-standard MMX instructions
3DNow! Technology for high-performance multimedia and 3D graphics
capabilities
Compatible with Super7
100-MHz frontside bus or Socket 7 66-MHz notebook
design
Ceramic Ball Grid Array (CBGA) and Socket 7-Compatible Ceramic Pin Grid Array
(CPGA) Package Options
Industry-Standard System Management Mode (SMM)
IEEE 1149.1 Boundary Scan
x86 Binary Software Compatibility
Low Voltage 0.25-Micron Process Technology
The Mobile AMD-K6
-2 processor is
AMD’s second generation mobile AMD-K6
processor delivering high performance for x86 notebook PC systems. The Mobile
AMD-K6-2 processor is a natural extension of the Mobile AMD-K6 processor and
incorporates the same leading-edge features, including the innovative and efficient
RISC86 microarchitecture, a large 64-Kbyte level-one cache (32-Kbyte dual-ported
data cache, 32-Kbyte instruction cache with predecode data), and a powerful IEEE
754-compatible and 854-compatible floating-point execution unit. In addition, the
Mobile AMD-K6-2 processor incorporates a number of new features, including a
superscalar MMX unit, support for a 100-MHz frontside bus, and AMD’s innovative
3DNow! technology for high-performance multimedia and 3D graphics operation.
N
N
N
N
N
N
N
I
N
N
N
I
I
I
I
I
I
I
I
I
相关PDF资料
PDF描述
MOBILE AMD-K6-III-P 32 Bit Processor with TriLevel Cache Design and Superscalar MMX Unit(带三级缓存和超标量MMX单元的32位处理器)
MOBILE AMD-K6 32 Bit Microprocessor With 64-K Byte Level-one Cache and Advanced RISC86 Superscalar Microarchitecture(32位微处理器带64K字节高速缓存和高级的RISC86超标量微体系结构)
MP028F036M12AL PRM Regulator 28 Vdc Input
MP151 15 Amp Single Phase Bridge Rectifier 50 to 1000 Volts
MP1505 SINGLE-PHASE GLASS PASSIVATED SILICON BRIDGE RECTIFIER (VOLTAGE RANGE 50 to 1000 Volts CURRENT 15 Amperes)
相关代理商/技术参数
参数描述
MOBP01-SR1 功能描述:PROGRAMMER FLASH 49K/77G/78A RoHS:是 类别:编程器,开发系统 >> 过时/停产零件编号 系列:- 标准包装:1 系列:- 类型:MCU 适用于相关产品:Freescale MC68HC908LJ/LK(80-QFP ZIF 插口) 所含物品:面板、缆线、软件、数据表和用户手册 其它名称:520-1035
MOBZ 制造商:MMD 制造商全称:MMD Components 功能描述:Oven Controlled Oscillator
MOC119 功能描述:晶体管输出光电耦合器 Optocoupler Photodarlington RoHS:否 制造商:Vishay Semiconductors 输入类型:DC 最大集电极/发射极电压:70 V 最大集电极/发射极饱和电压:0.4 V 绝缘电压:5300 Vrms 电流传递比:100 % to 200 % 最大正向二极管电压:1.65 V 最大输入二极管电流:60 mA 最大集电极电流:100 mA 最大功率耗散:100 mW 最大工作温度:+ 110 C 最小工作温度:- 55 C 封装 / 箱体:DIP-4 封装:Bulk
MOC119_Q 功能描述:晶体管输出光电耦合器 Optocoupler Photodarlington RoHS:否 制造商:Vishay Semiconductors 输入类型:DC 最大集电极/发射极电压:70 V 最大集电极/发射极饱和电压:0.4 V 绝缘电压:5300 Vrms 电流传递比:100 % to 200 % 最大正向二极管电压:1.65 V 最大输入二极管电流:60 mA 最大集电极电流:100 mA 最大功率耗散:100 mW 最大工作温度:+ 110 C 最小工作温度:- 55 C 封装 / 箱体:DIP-4 封装:Bulk
MOC119300 功能描述:晶体管输出光电耦合器 6-Pin Optocoupler Photodarlington RoHS:否 制造商:Vishay Semiconductors 输入类型:DC 最大集电极/发射极电压:70 V 最大集电极/发射极饱和电压:0.4 V 绝缘电压:5300 Vrms 电流传递比:100 % to 200 % 最大正向二极管电压:1.65 V 最大输入二极管电流:60 mA 最大集电极电流:100 mA 最大功率耗散:100 mW 最大工作温度:+ 110 C 最小工作温度:- 55 C 封装 / 箱体:DIP-4 封装:Bulk