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参数资料
| 型号： | MOBILE AMD-K6-2 |
| 厂商： | Advanced Micro Devices, Inc. |
| 英文描述： | 32 Bit Microprocessor With 64-Kbyte Level-one Cache and Advanced RISC86 Superscalar Microarchitecture(32位微处理器带64K字节高速缓存和高级的RISC86超标量微体系结构) |
| 中文描述： | 32位微处理器的64 -字节的一级缓存和高级RISC86超标微架构（32位微处理器带64K的字节高速缓存和高级的RISC86超标量微体系结构） |
| 文件页数： | 18/136页 |
| 文件大小： | 2960K |
| 代理商： | MOBILE AMD-K6-2 |
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4
Mobile AMD-K6
-2 Processor
Chapter 1
Mobile AMD-K6
-2 Processor Data Sheet
21896D/0—September 1999
Preliminary Information
The Mobile AMD-K6-2 processor includes several key features for the mobile market.
The processor is implemented using an AMD-developed, state-of-the-art low power
0.25-micron process technology. This process technology features a split-plane design
that allows the processor core to operate at a lower voltage while the I/O portion
operates at the industry-standard 3.3V level. The 0.25-micron process technology with
the split-plane voltage design enables the Mobile AMD-K6-2 processor to deliver
excellent portable PC performance solutions while utilizing a lower processor core
voltage, which results in lower power consumption and longer battery life. In addition,
the Mobile AMD-K6-2 processor includes the complete industry-standard System
Management Mode (SMM), which is critical to system resource and power
management. The Mobile AMD-K6-2 processor also features the industry-standard
Stop-Clock (STPCLK#) control circuitry and the Halt instruction, both required for
implementing the ACPI power management specification. Finally, the Mobile
AMD-K6-2 processor is offered in either a small, low-profile, lightweight,
thermally-efficient, 360-ball Ball Grid Array (CBGA) package that enables thin and
light system designs, or a standard Socket 7-compatible, 321-pin Ceramic Pin Grid
Array (CPGA) package.
The Mobile AMD-K6-2 processor’s RISC86 microarchitecture is a decoupled
decode/execution superscalar design that implements state-of-the-art design
techniques to achieve leading-edge performance. Advanced design techniques
implemented in the Mobile AMD-K6-2 processor include multiple x86 instruction
decode, single-clock internal RISC operations, ten execution units that support
superscalar operation, out-of-order execution, data forwarding, speculative
execution, and register renaming. In addition, the processor supports the industry’s
most advanced branch prediction logic by implementing an 8192-entry branch history
table, the industry’s only branch target cache, and a return address stack, which
combine to deliver better than a 95% prediction rate. These design techniques
enable the Mobile AMD-K6-2 processor to issue, execute, and retire multiple x86
instructions per clock, resulting in excellent scaleable performance.
AMD’s 3DNow! technology is an instruction set extension to x86, that includes 21 new
instructions to improve 3D graphics operations and other single precision floating-
point compute intensive operations. AMD has already shipped millions of AMD-K6-2
processors with 3DNow! technology for desktop PCs, revolutionizing the 3D
experience with up to four times the peak floating-point performance of previous
generation solutions. AMD is now bringing this advanced capability to notebook
computing, working in conjunction with advanced mobile 3D graphic controllers to
reach new levels of realism in mobile computing. With support from Microsoft
and
the x86 software developer community, a new generation of visually compelling
applications is coming to market that support the 3DNow! technology.
The Mobile AMD-K6-2 processor remains pin compatible with existing Socket 7
notebook solutions, however for maximum system performance, the processor works
optimally in newer Super7 designs that incorporate advanced features such as
support for the 100-MHz frontside bus and AGP graphics.
相关PDF资料 |
PDF描述 |
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| MOBILE AMD-K6-III-P | 32 Bit Processor with TriLevel Cache Design and Superscalar MMX Unit(带三级缓存和超标量MMX单元的32位处理器) |
| MOBILE AMD-K6 | 32 Bit Microprocessor With 64-K Byte Level-one Cache and Advanced RISC86 Superscalar Microarchitecture(32位微处理器带64K字节高速缓存和高级的RISC86超标量微体系结构) |
| MP028F036M12AL | PRM Regulator 28 Vdc Input |
| MP151 | 15 Amp Single Phase Bridge Rectifier 50 to 1000 Volts |
| MP1505 | SINGLE-PHASE GLASS PASSIVATED SILICON BRIDGE RECTIFIER (VOLTAGE RANGE 50 to 1000 Volts CURRENT 15 Amperes) |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MOBP01-SR1 | 功能描述:PROGRAMMER FLASH 49K/77G/78A RoHS:是 类别:编程器，开发系统 >> 过时/停产零件编号 系列:- 标准包装:1 系列:- 类型:MCU 适用于相关产品:Freescale MC68HC908LJ/LK（80-QFP ZIF 插口） 所含物品:面板、缆线、软件、数据表和用户手册 其它名称:520-1035 |
| MOBZ | 制造商:MMD 制造商全称:MMD Components 功能描述:Oven Controlled Oscillator |
| MOC119 | 功能描述:晶体管输出光电耦合器 Optocoupler Photodarlington RoHS:否 制造商:Vishay Semiconductors 输入类型:DC 最大集电极/发射极电压:70 V 最大集电极/发射极饱和电压:0.4 V 绝缘电压:5300 Vrms 电流传递比:100 % to 200 % 最大正向二极管电压:1.65 V 最大输入二极管电流:60 mA 最大集电极电流:100 mA 最大功率耗散:100 mW 最大工作温度:+ 110 C 最小工作温度:- 55 C 封装 / 箱体:DIP-4 封装:Bulk |
| MOC119_Q | 功能描述:晶体管输出光电耦合器 Optocoupler Photodarlington RoHS:否 制造商:Vishay Semiconductors 输入类型:DC 最大集电极/发射极电压:70 V 最大集电极/发射极饱和电压:0.4 V 绝缘电压:5300 Vrms 电流传递比:100 % to 200 % 最大正向二极管电压:1.65 V 最大输入二极管电流:60 mA 最大集电极电流:100 mA 最大功率耗散:100 mW 最大工作温度:+ 110 C 最小工作温度:- 55 C 封装 / 箱体:DIP-4 封装:Bulk |
| MOC119300 | 功能描述:晶体管输出光电耦合器 6-Pin Optocoupler Photodarlington RoHS:否 制造商:Vishay Semiconductors 输入类型:DC 最大集电极/发射极电压:70 V 最大集电极/发射极饱和电压:0.4 V 绝缘电压:5300 Vrms 电流传递比:100 % to 200 % 最大正向二极管电压:1.65 V 最大输入二极管电流:60 mA 最大集电极电流:100 mA 最大功率耗散:100 mW 最大工作温度:+ 110 C 最小工作温度:- 55 C 封装 / 箱体:DIP-4 封装:Bulk |
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