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参数资料
| 型号： | MPC5567MZP112 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | FLASH, 112 MHz, MICROCONTROLLER, PBGA416 |
| 封装： | 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-416 |
| 文件页数： | 56/66页 |
| 文件大小： | 1903K |
| 代理商： | MPC5567MZP112 |
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MPC5567 Microcontroller Data Sheet, Rev. 1.0
Electrical Characteristics
Freescale Semiconductor
6
3.2.1
General Notes for Specifications at Maximum Junction Temperature
An estimation of the device junction temperature, T
J, can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature for the package (oC)
RθJA = junction to ambient thermal resistance (oC/W)
PD = power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide
consistent values for estimations and comparisons. The difference between the values determined for the
single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground
plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance
depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to
connect the package to the planes reduces the thermal performance. Thinner planes also reduce the thermal
performance. When the clearance between the vias leave the planes virtually disconnected, the thermal
performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly
packed printed circuit board. The value obtained on a board with the internal planes is usually within the
normal range if the application board has:
One oz (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding
components. In addition, the ambient temperature varies widely within the application. For many natural
convection and especially closed box applications, the board temperature at the perimeter (edge) of the
package is approximately the same as the local air temperature near the device. Specifying the local
ambient conditions explicitly as the board temperature provides a more precise description of the local
ambient conditions that determine the temperature of the device.
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MPC551x
and
MPC5533
products
in
208
MAPBGA
packages;
MPC5534
and
MPC5553
products
in
208
and
496
MAPBGA
packages;
MPC5554,
MPC5565,
MPC5566
and
MPC5567
products
in
496
MAPBGA
packages
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC5567MZP112R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
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| MPC5567MZP132R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5567MZP80 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5567MZP80R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
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