参数资料
型号: MPC5604PEF0MLL4
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQFP100
封装: 14 X 14 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT LQFP-100
文件页数: 40/99页
文件大小: 1130K
代理商: MPC5604PEF0MLL4
MPC5604P Microcontroller Data Sheet, Rev. 7
Freescale Semiconductor
45
Figure 7. Independent ADC supply (3.0 V
V
DD_HV_REG 5.5 V)
3.5
Thermal characteristics
3.5.1
Package thermal characteristics
Table 10. Thermal characteristics for 144-pin LQFP
Symbol
Parameter
Conditions
Typical value Unit
RJA
Thermal resistance junction-to-ambient,
natural convection1
1 Junction-to-ambient thermal resistance determined per JEDEC JESD51-7. Thermal test board
meets JEDEC specification for this package.
Single layer board—1s
54.2
°C/W
Four layer board—2s2p
44.4
°C/W
RJB
Thermal resistance junction-to-board2
2 Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets
JEDEC specification for the specified package.
Four layer board—2s2p
29.9
°C/W
RJCtop Thermal resistance junction-to-case (top)
3
3 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold
plate temperature is used for the case temperature. Reported value includes the thermal resistance
of the interface layer.
Single layer board—1s
9.3
°C/W
JB
Junction-to-board, natural convection4
4 Thermal characterization parameter indicating the temperature difference between the board and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written as Psi-JB.
Operating conditions
30.2
°C/W
JC
Junction-to-case, natural convection5
Operating conditions
0.8
°C/W
5.5 V
3.0 V
VDD_HV_REG
3.0 V
5.5 V
VDD_HV_ADCx
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