参数资料
型号: MPC5646CCF0CLU8R
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, FLASH, 80 MHz, MICROCONTROLLER, PQFP176
封装: 24 X 24 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-176
文件页数: 70/115页
文件大小: 783K
代理商: MPC5646CCF0CLU8R
MPC5646C Microcontroller Datasheet, Rev. 4
Preliminary—Subject to Change Without Notice
Electrical Characteristics
Freescale Semiconductor
58
Table 24. Low voltage power domain electrical characteristics
Symbol
C
Parameter
Conditions1
1 V
DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C, unless otherwise specified All temperatures are based on
an ambient temperature.
Value
Unit
Min
Typ2
2 Target typical current consumption for the following typical operating conditions and configuration. Process =
typical, Voltage = 1.2 V.
Max3
3 Target maximum current consumption for mode observed under typical operating conditions. Process = Fast,
Voltage = 1.32 V.
IDDMAX
4
4 Running consumption is given on voltage regulator supply (V
DDREG). It does not include consumption linked to I/Os
toggling. This value is highly dependent on the application. The given value is thought to be a worst case value with
all cores and peripherals running, and code fetched from code flash while modify operation on-going on data flash.
It is to be noticed that this value can be significantly reduced by application: switch-off not used peripherals (default),
reduce peripheral frequency through internal prescaler, fetch from RAM most used functions, use low power mode
when possible.
CC D RUN mode maximum
average current
210
3005,6
5 Higher current may sunk by device during power-up and standby exit. Please refer to in rush current in Table 22.
6 Maximum “allowed” current is package dependent.
mA
IDDRUN
CC T RUN mode typical average
current7
7 Only for the “P” classification: Code fetched from RAM: Serial IPs CAN and LIN in loop back mode, DSPI as Master,
PLL as system Clock (4 x Multiplier) peripherals on (eMIOS/CTU/ADC) and running at max frequency, periodic
SW/WDG timer reset enabled. RUN current measured with typical application with accesses on both code flash
and RAM.
at 120 MHz
TA = 25 °C
1758,9
8 Subject to change, Configuration: 1 e200z4d + 4 kbit/s Cache, 1 eDMA (32 ch), 4 FlexCAN (2 500 kbit/s,
2 125 kbit/s), 10 LINFlexD (20 kbit/s), 8 DSPI (4 2 Mbit/s, 3 4Mbit/s, 1 10 Mbit/s), 40 PWM (200 Hz),
40 ADC Input, 1 CTU (40 ch.), 1 FlexRay (2 ch., 10 Mbit/s), 1 RTC, 4 PIT, 1 SWT, 1 STM. Ethernet
and e200z0h disabled. Also reduced timed I/O channels for smaller packages. RUN current measured with typical
application with accesses on both code flash and RAM.
2409,10
mA
Tat 80 MHz
TA = 25 °C
1108
15010
mA
IDDHALT
CC P HALT mode current11
25
35
mA
IDDSTOP
CC P STOP mode current12
No clocks active
TA = 25 °C
4009
12009,13 A
PTA = 150 °C
109
309
mA
IDDSTDBY3
(96 KB RAM
retained)
CC P STANDBY3 mode
current14
No clocks active
TA = 25 °C
60
175
A
PTA = 150 °C
1000
3000
A
IDDSTDBY2
(64 KB RAM
retained)
CC P STANDBY2 mode
current15
No clocks active
TA = 25 °C
45
135
A
PTA = 150 °C
800
2000
A
IDDSTDBY1
(8 KB RAM
retained)
CC T STANDBY1 mode
current16
No clocks active
TA = 25 °C
25
75
A
PTA = 150 °C
500
1000
A
Adders in LP
mode
CC T 32 kHz OSC
TA =25°C
5
A
4–40 MHz OSC
TA =25°C
3
mA
16 MHz IRC
TA =25°C
500
A
128 kHz IRC
TA =25°C
5
A
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