参数资料
型号: MPC603ERX133TX
厂商: MOTOROLA INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 133 MHz, RISC PROCESSOR, CBGA255
封装: 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
文件页数: 29/32页
文件大小: 149K
代理商: MPC603ERX133TX
6
PID6-603e Hardware Specifications, Rev 2
Table 5 provides the power consumption for the 603e.
Capacitance, Vin = 0 V, f = 1 MHz (excludes TS, ABB, DBB,
and ARTRY)
Cin
10.0
pF
2
Capacitance, Vin = 0 V, f = 1 MHz (for TS, ABB, DBB, and
ARTRY)
Cin
15.0
pF
2
Notes:
1. Excludes test signals (LSSD_MODE, L1_TSTCLK, L2_TSTCLK) and JTAG signals.
2. Capacitance is periodically sampled rather than 100% tested.
Table 5. Power Consumption
At recommended operating conditions. See Table 2.
CPU Clock:
SYSCLK
Processor (CPU) Frequency
Unit
Notes
100 MHz
133.33 MHz
Full-On Mode (DPM Enabled)
Typical
Max.
3.2
4.2
W
1, 3
4.0
5.3
W
1, 2
Doze Mode
Typical
1.0
1.3
W
1, 2
Nap Mode
Typical
70
85
mW
1, 2
Sleep Mode
Typical
40
50
mW
1, 2
Sleep Mode—PLL Disabled
Typical
5
6
mW
1, 2
Sleep Mode—PLL and SYSCLK Disabled
Typical
3
mW
1, 2
Notes:
1. These values apply for all valid bus ratios (PLL_CFG[0–3] settings). The
values do not include I/O supply power (OVdd) or PLL supply power
(AVdd). OVdd power is system dependent, but is typically <10% of Vdd
power. Worst-case power consumption for AVdd = 15 mw.
2. Maximum power is measured at Vdd = 3.465 V using a worst-case
instruction mix.
3. Typical power is an average value measured at Vdd = AVdd = OVdd = 3.3
V in a system executing typical applications and benchmark sequences
Table 4. DC Electrical Specifications (Continued)
At recommended operating conditions. See Table 2.
Characteristic
Symbol
Min
Max
Unit
Notes
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