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参数资料
| 型号： | MPC7410HX500LE |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件页数： | 3/52页 |
| 文件大小： | 943K |
| 代理商： | MPC7410HX500LE |
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MOTOROLA
MPC7410 RISC Microprocessor Hardware Specifications
11
Electrical and Thermal Characteristics
Table 5 provides the DC electrical characteristics for the MPC7410.
Junction-to-ambient thermal resistance, 400 ft/min airflow,
four-layer (2s2p) board
RθJMA
13
18
°C/W
Junction-to-board thermal resistance
RθJB
814
°C/W
4
Junction-to-case thermal resistance
RθJC
< 0.1
°C/W
5
Notes:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the calculated case temperature. The actual value of RθJC for the part is less
than 0.1°C/W.
Note: Refer to Section 1.8.8, “Thermal Management Information,” for more details about thermal management.
Table 5. DC Electrical Specifications
At recommended operating conditions (see Table 3)
Characteristic
Nominal
Bus
Voltage1
Symbol
Min
Max
Unit
Notes
Input high voltage (all inputs except
SYSCLK)
1.8
VIH
0.65
× (L2)OV
DD
(L2)OVDD + 0.2
V
2, 3, 8
2.5
VIH
1.7
(L2)OVDD + 0.2
3.3
VIH
2.0
OVDD + 0.3
Input low voltage (all inputs except
SYSCLK)
1.8
VIL
–0.3
0.35
× (L2)OV
DD
V8
2.5
VIL
–0.3
0.2
× (L2)OV
DD
3.3
VIL
–0.3
0.8
SYSCLK input high voltage
1.8
CVIH
1.5
OVDD + 0.2
V
2, 8
2.5
CVIH
2.0
OVDD + 0.2
3.3
CVIH
2.4
OVDD + 0.3
SYSCLK input low voltage
1.8
CVIL
–0.3
0.2
V
8
2.5
CVIL
–0.3
0.4
3.3
CVIL
–0.3
0.4
Table 4. Package Thermal Characteristics (continued)
Characteristic
Symbol
Value
Unit
Notes
MPC7410
CBGA
MPC7410
HCTE
CBGA
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC7410HX500LE | 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 500MHZ 360-FCCBGA |
| MPC7410RX400LE | 功能描述:微处理器 - MPU REV 1.4 1.8+/-.05V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC7410RX400NE | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MPC7410 RISC Microprocessor Hardware Specifications Addendum |
| MPC7410RX450NE | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MPC7410 RISC Microprocessor Hardware Specifications Addendum |
| MPC7410RX500LE | 功能描述:IC MPU 32BIT 500MHZ PPC 360-CBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC74xx 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
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