- 您现在的位置：买卖IC网 > PDF目录45353 > MPC7410RX400LE (FREESCALE SEMICONDUCTOR INC) 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 PDF资料下载
参数资料
| 型号： | MPC7410RX400LE |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件页数： | 43/56页 |
| 文件大小： | 864K |
| 代理商： | MPC7410RX400LE |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页当前第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
48
Freescale Semiconductor
Document Revision History
9
Document Revision History
Table 16 provides a revision history for this hardware specification.
Table 16. Document Revision History
Revision
Date
Substantive Change(s)
6.1
11/16/2007 Updated Table 17 and Table 19 to show the VU package is available as an MC prefix device compared
to an MPC prefix for the other package types; this was done to match the specification documents
with the device ordering and part marking information.
Updated title of Table 19 to reflect correct name of referenced document and updated respective
document order information below table.
nnnLE with Mxx7410xxnnnLE
since notes to apply to all the available packages types.
6
8/14/2007
Updated Table 4 thermal information:
Deleted rows on single-layer (1s) boards.
CBGA package RθJMA for natural convection for four layer boards changed from 17 to 18 °C/W.
HCTE package RθJMA for natural convection for four layer boards changed from 22 to 20 °C/W.
HCTE package RθJMA for 200 ft./min airflow for four layer boards changed from 19 to 16 °C/W with
airflow rate specification changed from 200 ft./min to 1 m/sec.
HCTE package RθJMA for 400 ft./min airflow for four layer boards changed from 18 to 15 °C/W with
airflow rate specification changed from 400 ft./min to 2 m/sec.
CBGA package RθJB changed from 8 to 9°C/W.
HCTE package RθJB changed from 14 to 11°C/W.
Table 4 Notes 2 - 4 have been revised and updated; Note 5 is no longer used. Notes on table rows
have been renumbered.
Updated Figure 26 removing optional heat sink clip to package.
Removed references in document to adhesive attached thermal solutions.
Updated thermal solution vendor information in Section 8.8.
Added HCTE_CBGA Lead Free C5 Spheres (VU) packaging information to document:
differences in dimensions A, A1, and b in the figure’s dimension table.
Changed part marking example in Figure 31 to an HCTE_CBGA device.
相关PDF资料 |
PDF描述 |
|---|---|
| MPC745BPX400LE | 32-BIT, 400 MHz, RISC PROCESSOR, PBGA255 |
| MPC745BPX350LE | 32-BIT, 350 MHz, RISC PROCESSOR, PBGA255 |
| MPC755BRX400LE | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 |
| MPC750PRX366LE | 32-BIT, 366 MHz, RISC PROCESSOR, CBGA360 |
| MPC750PRX400LE | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC7410RX400NE | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MPC7410 RISC Microprocessor Hardware Specifications Addendum |
| MPC7410RX450NE | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MPC7410 RISC Microprocessor Hardware Specifications Addendum |
| MPC7410RX500LE | 功能描述:IC MPU 32BIT 500MHZ PPC 360-CBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC74xx 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| MPC7410THX400LE | 功能描述:微处理器 - MPU NT HITCE RV1.4 1.8V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC7410THX400NE | 制造商:Freescale Semiconductor 功能描述:MPU MPC74XX RISC 64BIT 0.18UM 400MHZ 1.8V/2.5V/3.3V 360FCCBG - Bulk |
发布紧急采购，3分钟左右您将得到回复。