参数资料
型号: MPC8271CVRTIEA
厂商: Freescale Semiconductor
文件页数: 52/61页
文件大小: 0K
描述: IC MPU POWERQUICC II 516-PBGA
标准包装: 40
系列: MPC82xx
处理器类型: 32-位 MPC82xx PowerQUICC II
速度: 400MHz
电压: 1.5V
安装类型: 表面贴装
封装/外壳: 516-BBGA
供应商设备封装: 516-FPBGA(27x27)
包装: 托盘
MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 3
56
Freescale Semiconductor
Package Description
9
Package Description
This figure shows the side profile of the PBGA package to indicate the direction of the top surface view.
Figure 13. Side View of the PBGA Package Remove
9.1
Package Parameters
This table provides package parameters.
NOTE: Temperature Reflow for the VR Package
In the VR package, sphere composition is lead-free (see Table 2). This
requires higher temperature reflow than what is required for other
PowerQUICC II packages. Consult “Freescale PowerQUICC II Pb-Free
Packaging Information” (MPC8250PBFREEPKG) available on
www.freescale.com.
Table 22. Package Parameters
Code
Type
Outline
(mm)
Interconnects
Pitch
(mm)
Nominal Unmounted
Height (mm)
VR, ZQ
PBGA
27 x 27
516
1
2.25
Die
Transfer molding compound
1 mm pitch
Wire bonds
attach
DIE
Ball bond
Screen-printed
solder mask
Cu substrate traces
Resin glass epoxy
Plated substrate via
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