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参数资料
| 型号： | MPC8306SVMADDCA |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA369 |
| 封装： | 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 |
| 文件页数： | 61/71页 |
| 文件大小： | 452K |
| 代理商： | MPC8306SVMADDCA |
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MPC8306S PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 0
64
Freescale Semiconductor
Thermal
TT = thermocouple temperature on top of package (C)
JT = thermal characterization parameter (C/W)
PD = power dissipation in package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
21.1.5
Heat Sinks and Junction-to-Case Thermal Resistance
In some application environments, a heat sink is required to provide the necessary thermal management of
the device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case
thermal resistance and a case to ambient thermal resistance as shown in the following equation:
RJA =RJC +RCA
Eqn. 4
where:
RJA = junction-to-ambient thermal resistance (C/W)
RJC = junction-to-case thermal resistance (C/W)
RCA = case-to-ambient thermal resistance (C/W)
RJC is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been
simulated with a few commercially available heat sinks. The heat sink choice is determined by the
application environment (temperature, air flow, adjacent component power dissipation) and the physical
space available. Because there is not a standard application environment, a standard heat sink is not
required.
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
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| MPC8306SCVMADDCA | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA369 |
| MPC8306VMACDCA | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA369 |
| MPC8306CVMACDCA | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA369 |
| MPC8306VMABDCA | 32-BIT, 133 MHz, RISC PROCESSOR, PBGA369 |
| MPC8306CVMADDCA | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA369 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8306SVMADDCA | 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 266 MHz 369-LFBGA |
| MPC8306SVMAFDCA | 功能描述:微处理器 - MPU E300 MP 333 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8306VMABDC | 制造商:Freescale Semiconductor 功能描述:MPC8306VMABDC - Bulk |
| MPC8306VMABDCA | 功能描述:微处理器 - MPU E300 MP 133 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8306VMACDC | 制造商:Freescale Semiconductor 功能描述:MPC8306VMACDC - Bulk |
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