参数资料
型号: MPC8309VMADDCA
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 266 MHz, RISC PROCESSOR, PBGA489
封装: 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-489
文件页数: 9/81页
文件大小: 484K
代理商: MPC8309VMADDCA
MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 1
Freescale Semiconductor
17
DDR2 SDRAM
MCS output setup with respect to MCK
tDDKHCS
ns
3
333 MHz
266 MHz
2.4
2.5
MCS output hold with respect to MCK
tDDKHCX
ns
3
333 MHz
266 MHz
2.4
2.5
MCK to MDQS Skew
tDDKHMH
–0.6
0.6
ns
4
MDQ/MDM output setup with respect to MDQS
tDDKHDS,
tDDKLDS
ns
5
333 MHz
266 MHz
0.8
0.9
MDQ/MDM output hold with respect to MDQS
tDDKHDX,
tDDKLDX
ps
5
333 MHz
266 MHz
900
1100
MDQS preamble start
tDDKHMP
0.75 x tMCK
—ns
6
MDQS epilogue end
tDDKHME
0.4 x tMCK
0.6 x tMCK
ns
6
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can be read as DDR timing
(DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (AX or DX). For example,
tDDKHAS symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes from the high (H) state until outputs
(A) are setup (S) or output valid time. Also, tDDKLDX symbolizes DDR timing (DD) for the time tMCK memory clock reference
(K) goes low (L) until data outputs (D) are invalid (X) or data output hold time.
2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.
3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MDM/MDQS. For the ADDR/CMD
setup and hold specifications, it is assumed that the Clock Control register is set to adjust the memory clocks by 1/2 applied
cycle.
4. Note that tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR timing (DD)
from the rising edge of the MCK(n) clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be modified through control
of the DQSS override bits in the TIMING_CFG_2 register. This is typically set to the same delay as the clock adjusts in the
CLK_CNTL register. The timing parameters listed in the table assume that these 2 parameters have been set to the same
adjustment value. See the MPC8309 PowerQUICC II Pro Integrated Communications Processor Reference Manual for a
description and understanding of the timing modifications enabled by use of these bits.
5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), or data
mask (MDM). The data strobe should be centered inside of the data eye at the pins of the microprocessor.
6. tDDKHMP follows the symbol conventions described in note 1.
Table 16. DDR2 SDRAM Output AC Timing Specifications (continued)
At recommended operating conditions with GVDD of 1.8V ± 100mV.
Parameter
Symbol1
Min
Max
Unit
Note
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