参数资料
型号: MPC8314EVRADDA
厂商: Freescale Semiconductor
文件页数: 18/101页
文件大小: 0K
描述: MPU POWERQUICC II PRO 620-PBGA
标准包装: 36
系列: MPC83xx
处理器类型: 32-位 MPC83xx PowerQUICC II Pro
速度: 266MHz
电压: 1V
安装类型: 表面贴装
封装/外壳: 620-BBGA 裸露焊盘
供应商设备封装: 620-PBGA(29x29)
包装: 托盘
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
23
Ethernet: Three-Speed Ethernet, MII Management
9.1
eTSEC (10/100/1000 Mbps)—MII/RMII/RGMII/RTBI Electrical
Characteristics
The electrical characteristics specified here apply to all the media-independent interface (MII), reduced
gigabit MII (RGMII), and reduced ten-bit interface (RTBI) signals except management data input/output
(MDIO) and management data clock (MDC). The MII and RMII is defined for 3.3 V, while the RGMII,
and RTBI can operate at 2.5 V. The RGMII and RTBI follow the Hewlett-Packard reduced pin-count
interface for Gigabit Ethernet Physical Layer Device Specification Version 1.2a (9/22/2000). The
electrical characteristics for MDIO and MDC are specified in Section 9.3, “Ethernet Management
9.1.1
MII, RMII, RGMII, and RTBI DC Electrical Characteristics
All MII, RMII drivers and receivers comply with the DC parametric attributes specified in Table 23 for
3.3-V operation and RGMII, RTBI drivers and receivers comply with the DC parametric attributes
specified in Table 24. The RGMII and RTBI signals are based on a 2.5 V CMOS interface voltage as
defined by JEDEC EIA/JESD8–5.
NOTE
eTSEC should be interfaced with peripheral operating at same voltage level.
Table 23. MII/RMII (When Operating at 3.3 V) DC Electrical Characteristics
Parameter
Symbol
Conditions
Min
Max
Unit
Supply voltage 3.3 V
LVDD
——
3.0
3.6
V
Output high voltage
VOH
IOH = –4.0 mA
LVDD = Min
2.40
LVDD + 0.3
V
Output low voltage
VOL
IOL = 4.0 mA
LVDD = Min
VSS
0.50
V
Input high voltage
VIH
——
2.1
LVDD + 0.3
V
Input low voltage
VIL
–0.3
0.90
V
Input high current
IIH
VIN
1 = LVDD
40
A
Input low current
IIL
VIN
1 = VSS
–600
A
Note:
1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.
Table 24. RGMII/RTBI (When Operating at 2.5 V) DC Electrical Characteristics
Parameters
Symbol
Conditions
Min
Max
Unit
Supply voltage 2.5 V
LVDD
2.37
2.63
V
Output high voltage
VOH
IOH = –1.0 mA
LVDD = Min
2.00
LVDD + 0.3
V
Output low voltage
VOL
IOL = 1.0 mA
LVDD = Min
VSS– 0.3
0.40
V
Input high voltage
VIH
LVDD = Min
1.7
LVDD + 0.3
V
Input low voltage
VIL
LVDD =Min
–0.3
0.70
V
Input high current
IIH
VIN
1 = LVDD
15
A
Input low current
IIL
VIN
1 = VSS
–15
A
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MPC8314EVRAFDA 功能描述:微处理器 - MPU ENCRYPT RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8314EVRAGDA 功能描述:微处理器 - MPU ENCRYPT RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8314VRADDA 功能描述:微处理器 - MPU NON-ENCRYPT RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8314VRAFDA 功能描述:微处理器 - MPU NON-ENCRYPT RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8314VRAGDA 功能描述:微处理器 - MPU NON-ENCRYPT RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324