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| 型号： | MPC8315ECVRADDA |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 3/106页 |
| 文件大小： | 0K |
| 描述： | MPU POWERQUICC II PRO 620-PBGA |
| 标准包装： | 36 |
| 系列： | MPC83xx |
| 处理器类型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 266MHz |
| 电压： | 1V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 620-BBGA 裸露焊盘 |
| 供应商设备封装： | 620-PBGA（29x29） |
| 包装： | 托盘 |
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MPC8315E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
100
Freescale Semiconductor
System Design Information
25.3.1
Experimental Determination of the Junction Temperature with a
Heat Sink
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink temperature and
then back calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction to case
thermal resistance.
TJ = TC + (RJC x PD)
Where
TC is the case temperature of the package
RJC is the junction-to-case thermal resistance
PD is the power dissipation
26 System Design Information
This section provides electrical and thermal design recommendations for successful application of the
MPC8315E.
26.1
System Clocking
The MPC8315E includes two PLLs.
1. The platform PLL (AVDD2) generates the platform clock from the externally supplied
SYS_CLK_IN input. The frequency ratio between the platform and SYS_CLK_IN is selected
using the platform PLL ratio configuration bits as described in Section 24.1, “System PLL
2. The e300 Core PLL (AVDD1) generates the core clock as a slave to the platform clock. The
frequency ratio between the e300 core clock and the platform clock is selected using the e300
PLL ratio configuration bits as described in Section 24.2, “Core PLL Configuration.”
26.2
PLL Power Supply Filtering
Each of the PLLs listed above is provided with power through independent power supply pins
(AVDD1,AVDD2 respectively). The AVDD level should always be equivalent to VDD, and preferably
these voltages are derived directly from VDD through a low frequency filter scheme such as the following.
There are a number of ways to reliably provide power to the PLLs, but the recommended solution is to
provide independent filter circuits as illustrated in Figure 63, one to each of the AVDD pins. By providing
independent filters to each PLL the opportunity to cause noise injection from one PLL to the other is
reduced.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8315ECVRAFDA | 功能描述:微处理器 - MPU ENCRYPT RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8315ECVRAGDA | 功能描述:微处理器 - MPU ENCRYPT RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8315E-RDB | 功能描述:处理器 - 专门应用 PROCESSOR BD RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432 |
| MPC8315E-RDBA | 功能描述:开发板和工具包 - 其他处理器 PROCESSOR BD RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| MPC8315E-RDBA | 制造商:Freescale Semiconductor 功能描述:MPC8315E-RDB Reference Platform |
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