参数资料
型号: MPC8379E-RDBA
厂商: Freescale Semiconductor
文件页数: 38/117页
文件大小: 0K
描述: BOARD REF DESIGN MPC8379E
标准包装: 1
系列: PowerQUICC II™ PRO
类型: MPU
适用于相关产品: MPC8379E
所含物品:
MPC8379E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
Freescale Semiconductor
27
This figure provides the AC test load for eTSEC.
Figure 10. eTSEC AC Test Load
Duty cycle for 1000Base-T
tRGTH/tRGT
45
50
55
%
Duty cycle for 10BASE-T and 100BASE-TX
tRGTH/tRGT
40
50
60
%
3, 4
Rise time (20%–80%)
tRGTR
0.75
ns
Fall time (20%–80%)
tRGTF
0.75
ns
EC_GTX_CLK125 reference clock period
tG12
—8.0
ns
EC_GTX_CLK125 reference clock duty cycle
measured at 0.5
× LVDD1
tG125H/tG125
47
53
%
Notes:
1. Note that, in general, the clock reference symbol representation for this section is based on the symbols RGT to represent
RGMII and RTBI timing. Note also that the notation for rise (R) and fall (F) times follows the clock symbol that is being
represented. For symbols representing skews, the subscript is skew (SK) followed by the clock that is being skewed (RGT).
2. This implies that PC board design will require clocks to be routed such that an additional trace delay of greater than 1.5 ns
will be added to the associated clock signal.
3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively.
4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains as
long as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed
transitioned between
5. This symbol represents the external EC_GTX_CLK125 and does not follow the original signal naming convention.
Table 28. RGMII and RTBI AC Timing Specifications (continued)
At recommended operating conditions with LVDD of 2.5 V ± 5%.
Parameter
Symbol1
Min
Typical
Max
Unit
Note
Output
Z0 = 50 Ω
LVDD/2
RL = 50 Ω
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