参数资料
型号: MPC8379EVRAJFA
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 333 MHz, MICROPROCESSOR, PBGA689
封装: 31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-689
文件页数: 17/114页
文件大小: 1337K
代理商: MPC8379EVRAJFA
MPC8379E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
113
Document Revision History
26 Document Revision History
Table 83 provides a revision history for this hardware specification.
Revision
Date
Substantive Change(s)
2
10/2009
In Table 3, “Recommended Operating Conditions,” added “Operating temperature range” values.
In Table 5, “MPC8377E Power Dissipation 1,” added a column for “Typical Application at Tj =65°C (W)”.
In Table 5, “MPC8377E Power Dissipation 1,” added a column for “Sleep Power at Tj =65°C (W)”.
In Table 10, removed overbar from CFG_CLKIN_DIV.
In Table 16, “Current Draw Characteristics for MVREF,” updated IMVREF maximum value for both DDR1
and DDR2 to 600 and 400
μA, respectively. Also, updated Note 1 and added Note 2.
Min” and “Max”. Footnote 2 updated to state “T is the MCK clock period”.
DDR2 SDRAM Output AC Timing Specifications,” clarified that the frequency parameters are data rates.
Specifications,” corrected titles from “Transmitter” to “Receiver”.
to VDD pin.
In Table 70, Operating Frequencies for TePBGA II,” corrected “DDR2 memory bus frequency (MCK)”
In Table 75, e300 Core PLL Configuration,added 3.5:1 and 4:1 core_clk: csb_clk ratio options.
In Table 76, Example Clock Frequency Combinations,” updated column heading to “DDR data rate” .
In Section 19.2, “SPI AC Timing Specifications,corrected tNIKHOX and tNEKHOX to tNIKHOV and tNEKHOV,
1
02/2009
In Table 3, “Recommended Operating Conditions,” added two new rows for 800 MHz, and created two
In Table 5, “MPC8377E Power Dissipation 1,” added Notes 4 and 5. In addition, changed 666 to 667
MHz.
footnote to references to MVREF, MDQ, and MDQS, referencing AN3665,
MPC837xE Design Checklist.
In Table 20, updated tDDKHCX minimum value for 333 MHz to 2.40.
In Table 68, TePBGA II Pinout Listing,” added footnote to USBDR_STP_SUSPEND and modified
footnote 10 and added footnote 13.
In Table 70, Operating Frequencies for TePBGA II,” changed 667 to 800 MHz for
core_clk.
In Table 76, Example Clock Frequency Combinations,” added 800 MHz cells for e300 core.
Updated part numbering information in AF column in Table 80, “Part Numbering Nomenclature.” In
addition, modified extended temperature information in notes 1 and 4.
In Table 81, Available Parts (Core/DDR Data Rate),” added new row for 800/400 MHz.
0
12/2008 Initial public release.
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