参数资料
型号: MPC8379EVRAJFA
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 333 MHz, MICROPROCESSOR, PBGA689
封装: 31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-689
文件页数: 2/114页
文件大小: 1337K
代理商: MPC8379EVRAJFA
MPC8379E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
10
Freescale Semiconductor
Power Characteristics
2.2
Power Sequencing
The device requires its power rails to be applied in a specific sequence in order to ensure proper device
operation. During the power ramp up, before the power supplies are stable and if the I/O voltages are
supplied before the core voltage, there may be a period of time that all input and output pins will actively
be driven and cause contention and excessive current. To avoid actively driving the I/O pins and to
eliminate excessive current draw, apply the core voltages (VDD and AVDD) before the I/O voltages and
assert PORESET before the power supplies fully ramp up. VDD and AVDD must reach 90% of their
nominal value before GVDD, LVDD, and OVDD reach 10% of their value, see Figure 3. I/O voltage
supplies, GVDD, LVDD, and OVDD do not have any ordering requirements with respect to one another.
Figure 3. Power-Up Sequencing Example
Please note that the SerDes power supply (L[1,2]_nVDD) should follow the same timing as the core supply
(VDD).
The opposite sequence applies to the power down requirements. The I/O supplies must go down first and
immediately followed by the core and PLL supplies.
3
Power Characteristics
The estimated typical power dissipation for the MPC8379E device is shown in Table 5.
Table 5. MPC8379E Power Dissipation 1
Core Frequency
(MHz)
CSB/DDR Frequency
(MHz)
Sleep Power
at Tj =65°C (W)
Typical Application
at Tj =65°C (W)
Typical Application
at Tj =125°C (W)
Max Application
at Tj =125°C (W)
333
333
1.45
1.9
3.2
3.8
167
1.45
1.8
3.0
3.6
400
400
1.45
2.0
3.3
4.0
266
1.45
1.9
3.1
3.8
t
90%
V
Core Voltage (VDD, AVDD)
I/O Voltage (GVDD, LVDD, and OVDD)
0
0.7 V
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