参数资料
型号: MPC8544ECVTAQJB
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA783
封装: 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-783
文件页数: 6/120页
文件大小: 1321K
代理商: MPC8544ECVTAQJB
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
103
Thermal
Figure 62. Package with Heat Sink Mounted to a Printed-Circuit Board
The heat sink removes most of the heat from the device. Heat generated on the active side of the chip is
conducted through the silicon and through the heat sink attach material (or thermal interface material), and
finally to the heat sink. The junction-to-case thermal resistance is low enough that the heat sink attach
material and heat sink thermal resistance are the dominant terms.
20.3.2
Thermal Interface Materials
A thermal interface material is required at the package-to-heat sink interface to minimize the thermal
contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 63 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
As shown, the performance of these thermal interface materials improves with increasing contact pressure.
The use of thermal grease significantly reduces the interface thermal resistance. The bare joint results in a
thermal resistance approximately six times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 61). Therefore, the synthetic grease offers the best thermal performance, especially at the low
interface pressure.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
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