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参数资料
型号： MPC8548VUAVGB
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 1500 MHz, MICROPROCESSOR, CBGA783
封装： 29 X 29 MM, 1 MM PITCH, FLIP CHIP, LEAD FREE, CERAMIC, BGA-783
文件页数： 31/142页
文件大小： 1504K
代理商： MPC8548VUAVGB
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
126
Freescale Semiconductor
Thermal
20 Thermal
This section describes the thermal specifications of the MPC8548.
20.1
Thermal for Version 2.0 Silicon HiCTE FC-CBGA with Full Lid
This section describes the thermal specifications for the HiCTE FC-CBGA package for revision 2.0
silicon.
Table 80 shows the package thermal characteristics.
20.2
Thermal for Version 2.1.1 and 2.1.2 Silicon FC-PBGA with Full Lid
This section describes the thermal specifications for the FC-PBGA package for revision 2.1.1 silicon.
Table 81 shows the package thermal characteristics.
Table 80. Package Thermal Characteristics for HiCTE FC-CBGA
Characteristic
JEDEC Board
Symbol
Value
Unit
Notes
Die junction-to-ambient (natural convection)
Single-layer board (1s)
RθJA
17
°C/W
1, 2
Die junction-to-ambient (natural convection)
Four-layer board (2s2p)
RθJA
12
°C/W
1, 2
Die junction-to-ambient (200 ft/min)
Single-layer board (1s)
RθJA
11
°C/W
1, 2
Die junction-to-ambient (200 ft/min)
Four-layer board (2s2p)
RθJA
8°C/W
1, 2
Die junction-to-board
N/A
RθJB
3°C/W
3
Die junction-to-case
N/A
RθJC
0.8
°C/W
4
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1). The cold plate temperature is used for the case temperature, measured value includes the thermal resistance of the
interface layer.
Table 81. Package Thermal Characteristics for FC-PBGA
Characteristic
JEDEC Board
Symbol
Value
Unit
Notes
Die junction-to-ambient (natural convection)
Single-layer board (1s)
RθJA
18
°C/W
1, 2
Die junction-to-ambient (natural convection)
Four-layer board (2s2p)
RθJA
13
°C/W
1, 2
Die junction-to-ambient (200 ft/min)
Single-layer board (1s)
RθJA
13
°C/W
1, 2
Die junction-to-ambient (200 ft/min)
Four-layer board (2s2p)
RθJA
9°C/W
1, 2
Die junction-to-board
N/A
RθJB
5°C/W
3
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相关代理商/技术参数
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MPC8548VUAVH 制造商:Freescale Semiconductor 功能描述:MPU RISC 32BIT CMOS 1.5GHZ 1.8V/2.5V/3.3V 783FCCBGA - Bulk
MPC8548VUAVK 制造商:Freescale Semiconductor 功能描述:PQ38 8548 PB-FREE - Bulk
MPC8555CDS 功能描述:开发板和工具包 - 其他处理器 CDS EVAL BOARD FOR 8555 RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压:
MPC8555CDS 制造商:Freescale Semiconductor 功能描述:CDS EVAL BOARD FOR 8555
MPC8555CPXAJD 功能描述:微处理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
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