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参数资料
型号： MPC8560VTAQFC
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA783
封装： 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783
文件页数： 91/104页
文件大小： 1244K
代理商： MPC8560VTAQFC
MPC8560 Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
87
Thermal
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
16.2.4
Heat Sink Selection Examples
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
16.2.4.1
Case 1
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
TJ = TI + TR + (θJC + θINT + θSA) × PD
where
TJ is the die-junction temperature
TI is the inlet cabinet ambient temperature
TR is the air temperature rise within the computer cabinet
θ
JC is the junction-to-case thermal resistance
θINT is the adhesive or interface material thermal resistance
θSA is the heat sink base-to-ambient thermal resistance
PD is the power dissipated by the device
During operation the die-junction temperatures (TJ) should be maintained within the range specified in
Table 2. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (TA)
may range from 30
° to 40°C. The air temperature rise within a cabinet (T
R) may be in the range of 5° to
10
°C. The thermal resistance of some thermal interface material (θ
INT) may be about 1°C/W. Assuming a
TI of 30 C, a TR of 5 C, a FC-PBGA package θJC = 0.8, and a power consumption (PD) of 7.0 W, the
following expression for TJ is obtained:
Die-junction temperature: TJ = 30°C + 5°C + (0.8°C/W + 1.0°C/W + θSA) × 7.0 W
The heat sink-to-ambient thermal resistance (
θ
SA) versus airflow velocity for a Thermalloy heat sink
#2328B is shown in Figure 55.
Assuming an air velocity of 2 m/s, we have an effective
θ
SA+ of about 3.3
C/W, thus
TJ = 30 C + 5 C + (0.8 C/W +1.0 C/W + 3.3 C/W) × 7.0 W,
resulting in a die-junction temperature of approximately 71 C which is well within the maximum
operating temperature of the component.
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