参数资料
型号: MPC866T
厂商: 飞思卡尔半导体(中国)有限公司
英文描述: Hardware Specifications
中文描述: 硬件规格
文件页数: 5/92页
文件大小: 1274K
代理商: MPC866T
MOTOROLA
MPC866/859 Hardware Specications
13
Thermal Calculation and Measurement
Figure 3. Effect of Board Temperature Rise on Thermal Behavior
If the board temperature is known, an estimate of the junction temperature in the environment can be made
using the following equation:
TJ = TB +(RθJB x PD)
where:
RθJB = junction-to-board thermal resistance (C/W)
TB = board temperature C
PD = power dissipation in package
If the board temperature is known and the heat loss from the package case to the air can be ignored,
acceptable predictions of junction temperature can be made. For this method to work, the board and board
mounting must be similar to the test board used to determine the junction-to-board thermal resistance,
namely a 2s2p (board with a power and a ground plane) and vias attaching the thermal balls to the ground
plane.
7.4
Estimation Using Simulation
When the board temperature is not known, a thermal simulation of the application is needed. The simple
two-resistor model can be used with the thermal simulation of the application [2], or a more accurate and
complex model of the package can be used in the thermal simulation.
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Board Temperture Rise Above Ambient Divided by Package
Power
Junction
Temperature
Rise
Above
Ambient
Divided
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Package
Power
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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