参数资料
型号: MPC866TVR100A
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 100 MHz, RISC PROCESSOR, PBGA357
封装: LEAD FREE, PLASTIC, BGA-357
文件页数: 5/96页
文件大小: 1303K
代理商: MPC866TVR100A
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
13
Thermal Calculation and Measurement
Figure 3. Effect of Board Temperature Rise on Thermal Behavior
If the board temperature is known, an estimate of the junction temperature in the environment can be made using
the following equation:
TJ = TB +(RθJB x PD)
where:
RθJB = junction-to-board thermal resistance (C/W)
TB = board temperature C
PD = power dissipation in package
If the board temperature is known and the heat loss from the package case to the air can be ignored, acceptable
predictions of junction temperature can be made. For this method to work, the board and board mounting must be
similar to the test board used to determine the junction-to-board thermal resistance, namely a 2s2p (board with a
power and a ground plane) and vias attaching the thermal balls to the ground plane.
7.4
Estimation Using Simulation
When the board temperature is not known, a thermal simulation of the application is needed. The simple two-resistor
model can be used with the thermal simulation of the application [2], or a more accurate and complex model of the
package can be used in the thermal simulation.
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MPC866TZP133A 功能描述:微处理器 - MPU POWER QUICC I HIP6W RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
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