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参数资料
型号： MPC875EC
厂商： 飞思卡尔半导体(中国)有限公司
英文描述： Hardware Specifications
中文描述： 硬件规格
文件页数： 14/84页
文件大小： 1366K
代理商： MPC875EC
MPC875/MPC870 Hardware Specifications, Rev. 3.0
21
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
B31
CLKOUT falling edge to CS valid, as
requested by control bit CST4 in the
corresponding word in the UPM
(MAX = 0.00
× B1 + 6.00)
1.50
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
B31a
CLKOUT falling edge to CS valid, as
requested by control bit CST1 in the
corresponding word in the UPM
(MAX = 0.25
× B1 + 6.80)
7.60
14.30
6.30
13.00
3.80
10.50
3.13
10.00
ns
B31b
CLKOUT rising edge to CS valid, as
requested by control bit CST2 in the
corresponding word in the UPM
(MAX = 0.00
× B1 + 8.00)
1.50
8.00
1.50
8.00
1.50
8.00
1.50
8.00
ns
B31c
CLKOUT rising edge to CS valid, as
requested by control bit CST3 in the
corresponding word in the UPM
(MAX = 0.25
× B1 + 6.30)
7.60
13.80
6.30
12.50
3.80
10.00
3.13
9.40
ns
B31d
CLKOUT falling edge to CS valid, as
requested by control bit CST1 in the
corresponding word in the UPM EBDF = 1
(MAX = 0.375
× B1 + 6.6)
13.30 18.00 11.30 16.00
7.60
12.30
4.69
11.30
ns
B32
CLKOUT falling edge to BS valid, as
requested by control bit BST4 in the
corresponding word in the UPM
(MAX = 0.00
× B1 + 6.00)
1.50
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
B32a
CLKOUT falling edge to BS valid, as
requested by control bit BST1 in the
corresponding word in the UPM, EBDF = 0
(MAX = 0.25
× B1 + 6.80)
7.60
14.30
6.30
13.00
3.80
10.50
3.13
10.00
ns
B32b
CLKOUT rising edge to BS valid, as
requested by control bit BST2 in the
corresponding word in the UPM
(MAX = 0.00
× B1 + 8.00)
1.50
8.00
1.50
8.00
1.50
8.00
1.50
8.00
ns
B32c
CLKOUT rising edge to BS valid, as
requested by control bit BST3 in the
corresponding word in the UPM
(MAX = 0.25
× B1 + 6.80)
7.60
14.30
6.30
13.00
3.80
10.50
3.13
10.00
ns
B32d
CLKOUT falling edge to BS valid, as
requested by control bit BST1 in the
corresponding word in the UPM, EBDF = 1
(MAX = 0.375
× B1 + 6.60)
13.30 18.00 11.30 16.00
7.60
12.30
4.49
11.30
ns
B33
CLKOUT falling edge to GPL valid, as
requested by control bit GxT4 in the
corresponding word in the UPM
(MAX = 0.00
× B1 + 6.00)
1.50
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
Table 10. Bus Operation Timings (continued)
Num
Characteristic
33 MHz
40 MHz
66 MHz
80 MHz
Unit
Min
Max
Min
Max
Min
Max
Min
Max
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相关代理商/技术参数
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MPC875VR133 功能描述:微处理器 - MPU 133 MHz 176 MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC875VR66 功能描述:微处理器 - MPU 66 MHz 87 MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC875VR80 功能描述:微处理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC875ZT133 功能描述:微处理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC875ZT66 功能描述:微处理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
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