收藏本站
参数资料
型号： MPC880ZP133
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 133 MHz, RISC PROCESSOR, PBGA357
封装： PLASTIC, BGA-357
文件页数： 15/87页
文件大小： 1046K
代理商： MPC880ZP133
MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7
22
Freescale Semiconductor
Bus Signal Timing
B32
CLKOUT falling edge to BS valid, as requested by
control bit BST4 in the corresponding word in the
UPM (MAX = 0.00
× B1 + 6.00)
1.50
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
B32a
CLKOUT falling edge to BS valid, as requested by
control bit BST1 in the corresponding word in the
UPM, EBDF = 0 (MAX = 0.25
× B1 + 6.80)
7.60
14.30
6.30
13.00
3.80
10.50
3.13
10.00
ns
B32b
CLKOUT rising edge to BS valid, as requested by
control bit BST2 in the corresponding word in the
UPM (MAX = 0.00
× B1 + 8.00)
1.50
8.00
1.50
8.00
1.50
8.00
1.50
8.00
ns
B32c
CLKOUT rising edge to BS valid, as requested by
control bit BST3 in the corresponding word in the
UPM (MAX = 0.25
× B1 + 6.80)
7.60
14.30
6.30
13.00
3.80
10.50
3.13
10.00
ns
B32d
CLKOUT falling edge to BS valid, as requested by
control bit BST1 in the corresponding word in the
UPM, EBDF = 1 (MAX = 0.375
× B1 + 6.60)
13.30 18.00 11.30 16.00
7.60
12.30
4.49
11.30
ns
B33
CLKOUT falling edge to GPL valid, as requested
by control bit GxT4 in the corresponding word in
the UPM (MAX = 0.00
× B1 + 6.00)
1.50
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
B33a
CLKOUT rising edge to GPL valid, as requested
by control bit GxT3 in the corresponding word in
the UPM (MAX = 0.25
× B1 + 6.80)
7.60
14.30
6.30
13.00
3.80
10.50
3.13
10.00
ns
B34
A(0:31), BADDR(28:30), and D(0:31) to CS valid,
as requested by control bit CST4 in the
corresponding word in the UPM
(MIN = 0.25
× B1 – 2.00)
5.60
—
4.30
—
1.80
—
1.13
—
ns
B34a
A(0:31), BADDR(28:30), and D(0:31) to CS valid,
as requested by control bit CST1 in the
corresponding word in the UPM
(MIN = 0.50
× B1 – 2.00)
13.20
—
10.50
—
5.60
—
4.25
—
ns
B34b
A(0:31), BADDR(28:30), and D(0:31) to CS valid,
as requested by CST2 in the corresponding word
in UPM (MIN = 0.75
× B1 – 2.00)
20.70
—
16.70
—
9.40
—
6.80
—
ns
B35
A(0:31), BADDR(28:30) to CS valid, as requested
by control bit BST4 in the corresponding word in
the UPM (MIN = 0.25
× B1 – 2.00)
5.60
—
4.30
—
1.80
—
1.13
—
ns
B35a
A(0:31), BADDR(28:30), and D(0:31) to BS valid,
as requested by BST1 in the corresponding word
in the UPM (MIN = 0.50
× B1–2.00)
13.20
—
10.50
—
5.60
—
4.25
—
ns
B35b
A(0:31), BADDR(28:30), and D(0:31) to BS valid,
as requested by control bit BST2 in the
corresponding word in the UPM
(MIN = 0.75
× B1 – 2.00)
20.70
—
16.70
—
9.40
—
7.40
—
ns
Table 9. Bus Operation Timings (continued)
Num
Characteristic
33 MHz
40 MHz
66 MHz
80 MHz
Unit
Min
Max
Min
Max
Min
Max
Min
Max
相关PDF资料
PDF描述
MC9S12B128CFU25 16-BIT, FLASH, 25 MHz, MICROCONTROLLER, PQFP80
MC9S12B128MPV16 16-BIT, FLASH, 16 MHz, MICROCONTROLLER, PQFP112
MC9S12B128MPV25 16-BIT, FLASH, 25 MHz, MICROCONTROLLER, PQFP112
MC9S12B128VFU16 16-BIT, FLASH, 16 MHz, MICROCONTROLLER, PQFP80
MC9S12B128VPV16 16-BIT, FLASH, 16 MHz, MICROCONTROLLER, PQFP112
相关代理商/技术参数
参数描述
MPC880ZP66 功能描述:微处理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC880ZP80 功能描述:微处理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC885ADS 功能描述:开发板和工具包 - 其他处理器 DUET885 RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压:
MPC885ADSE 功能描述:开发板和工具包 - 其他处理器 DUET885 RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压:
MPC885CVR133 功能描述:微处理器 - MPU 133 MHz 176 MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*