参数资料
| 型号： | MR25H10CDC |
| 厂商： | Everspin Technologies Inc |
| 文件页数： | 8/20页 |
| 文件大小： | 0K |
| 描述： | IC MRAM 1MBIT 40MHZ 8DFN |
| 标准包装： | 570 |
| 格式 - 存储器： | RAM |
| 存储器类型： | MRAM（磁阻 RAM） |
| 存储容量： | 1M (128K x 8) |
| 速度： | 40MHz |
| 接口： | SPI 串行 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-VDFN 裸露焊盘 |
| 供应商设备封装： | 8-DFN-EP，大型标志（5x6） |
| 包装： | 托盘 |
| 其它名称： | 819-1014 |
MR25H10
SPI COMMUNICATIONS PROTOCOL
Write Data Bytes (WRITE)
The Write Data Bytes (WRITE) command allows data bytes to be written starting at an address specified by
the 24-bit address. Only address bits 0-16 are decoded by the memory. The data bytes are written sequen-
tially in memory until the write operation is terminated by bringing CS high. The entire memory can be
written in a single command. The address counter will roll over to 0000h when the address reaches the top
of memory.
Unlike EEPROM or Flash Memory, MRAM can write data bytes continuously at its maximum rated clock
speed without write delays or data polling. Back to back WRITE commands to any random location in mem-
ory can be executed without write delay. MRAM is a random access memory rather than a page, sector, or
block organized memory so it is ideal for both program and data storage.
The WRITE command is entered by driving CS low, sending the command code, and then sequential write
data bytes. Writes continue as long as the memory is clocked. The command is terminated by bringing CS
high.
Figure 2.6 WRITE
CS
0
1
2
3
4
5
6
7
8
9
10
28
29
30
31
32
33
34
35
36
37
38
39
SCK
Instruction (02h)
24-Bit Address
SI
0
0
0
0
0
0
1
0
X
X
X
3
2
1
0
7
6
5
4
3
2
1
0
MSB
MSB
SO
CS
High Impedance
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
Mode 3
SCK
Mode 0
Data Byte 2
Data Byte 3
Data Byte N
SI
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
SO
MSB
High Impedance
MSB
Copyright ? Everspin Technologies 2013
8
MR25H10 Rev. 9, 4/2013
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| MR25H10CDCR | 功能描述:NVRAM 1Mb 3.3V 128Kx8 Serial MRAM RoHS:否 制造商:Maxim Integrated 数据总线宽度:8 bit 存储容量:1024 Kbit 组织:128 K x 8 接口类型:Parallel 访问时间:70 ns 电源电压-最大:5.5 V 电源电压-最小:4.5 V 工作电流:85 mA 最大工作温度:+ 70 C 最小工作温度:0 C 封装 / 箱体:EDIP 封装:Tube |
| MR25H10CDF | 功能描述:NVRAM 1Mb 3.3V 128Kx8 Serial MRAM RoHS:否 制造商:Maxim Integrated 数据总线宽度:8 bit 存储容量:1024 Kbit 组织:128 K x 8 接口类型:Parallel 访问时间:70 ns 电源电压-最大:5.5 V 电源电压-最小:4.5 V 工作电流:85 mA 最大工作温度:+ 70 C 最小工作温度:0 C 封装 / 箱体:EDIP 封装:Tube |
| MR25H10CDFR | 功能描述:NVRAM 1Mb 3.3V 128Kx8 Serial MRAM RoHS:否 制造商:Maxim Integrated 数据总线宽度:8 bit 存储容量:1024 Kbit 组织:128 K x 8 接口类型:Parallel 访问时间:70 ns 电源电压-最大:5.5 V 电源电压-最小:4.5 V 工作电流:85 mA 最大工作温度:+ 70 C 最小工作温度:0 C 封装 / 箱体:EDIP 封装:Tube |
| MR25H10MDC | 功能描述:NVRAM 1Mb 3V 128Kx8 Serial MRAM RoHS:否 制造商:Maxim Integrated 数据总线宽度:8 bit 存储容量:1024 Kbit 组织:128 K x 8 接口类型:Parallel 访问时间:70 ns 电源电压-最大:5.5 V 电源电压-最小:4.5 V 工作电流:85 mA 最大工作温度:+ 70 C 最小工作温度:0 C 封装 / 箱体:EDIP 封装:Tube |
| MR25H10MDCR | 功能描述:NVRAM 1Mb 3V 128Kx8 Serial MRAM RoHS:否 制造商:Maxim Integrated 数据总线宽度:8 bit 存储容量:1024 Kbit 组织:128 K x 8 接口类型:Parallel 访问时间:70 ns 电源电压-最大:5.5 V 电源电压-最小:4.5 V 工作电流:85 mA 最大工作温度:+ 70 C 最小工作温度:0 C 封装 / 箱体:EDIP 封装:Tube |
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