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参数资料
| 型号： | MR760 |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | 整流器 |
| 英文描述： | 6 A, 1000 V, SILICON, RECTIFIER DIODE |
| 封装： | PLASTIC, CASE 194-04, 2 PIN |
| 文件页数： | 4/7页 |
| 文件大小： | 96K |
| 代理商： | MR760 |
MR750 SERIES
http://onsemi.com
4
Figure 5. Maximum Current Ratings
TL, LEAD TEMPERATURE (°C)
0
8.0
I F(A
V)
0
12
20
28
40
80
120
160
200
Figure 6. Maximum Current Ratings
0
8.0
4.0
0
16
24
32
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
P
F(A
V)
Figure 7. Power Dissipation
,POWER
DISSIP
A
TION
(W
A
TTS)
5/8"
,A
VERAGE
FOR
W
ARD
CURRENT
(AMPS)
CAPACITANCE LOADS
8.0
12
16
RESISTIVE INDUCTIVE
LOADS
TA, AMBIENT TEMPERATURE (°C)
0
1.0
I F(A
V)
0
2.0
3.0
4.0
40
80
120
160
200
Figure 8. Steady State Thermal Resistance
f = 60 Hz
,A
VERAGE
FOR
W
ARD
CURRENT
(AMPS)
RESISTIVE INDUCTIVE LOADS
CAPACITANCE LOADS 1
F & 3F
20
6
F
1
F & 3F
20 Iavg
TA(A)
TA(K)
TL(A)
TC(A)
TJ
TC(K)
TL(K)
PF
RqS(A)
RqL(A)
RqJ(A)
RqJ(K)
RqL(K)
RqS(K)
Use of the above model permits junction to lead thermal resistance for
any mounting configuration to be found. Lowest values occur when one
side of the rectifier is brought as close as possible to the heat sink as
shown below. Terms in the model signify:
TA = Ambient Temperature
TC = Case Temperature
TL = Lead Temperature
TJ = Junction Temperature
RqS = Thermal Resistance, Heat Sink to Ambient
RqL = Thermal Resistance, Lead to Heat Sink
RqJ = Thermal Resistance, Junction to Case
PF = Power Dissipation
(Subscripts A and K refer to anode and cathode sides, respectively.)
Values for thermal resistance components are:
RqL = 40°C/W/in. Typically and 44°C/W/in Maximum.
RqJ = 2°C/W typically and 4°C/W Maximum.
Since RqJ is so low, measurements of the case temperature, TC, will be
approximately equal to junction temperature in practical lead mounted
applications. When used as a 60 Hz rectifierm the slow thermal response
holds TJ(PK) close to TJ(AVG). Therefore maximum lead temperature may
be found from: TL = 175°RqJL PF. PF may be found from Figure 7.
The recommended method of mounting to a P.C. board is shown on the
sketch, where RqJA is approximately 25°C/W for a 11/2" x 11/2" copper
surface area. Values of 40
°C/W are typical for mounting to terminal strips
or P.C. boards where available surface area is small.
Board Ground Plane
Recommended mounting for half wave circuit
24
28
32
0
1/4
5.0
0
1/2
3/4
1.0
L, LEAD LENGTH (INCHES)
R
JL
,THERMAL
RESIST
ANCE,
SINGLE LEAD TO HEAT SINK,
INSIGNIFICANT HEAT FLOW
THROUGH OTHER LEAD
10
15
20
25
30
35
40
24
16
4.0
20
60
100
140
180
4.0
12
20
28
1/8
3/8
5/8
7/8
θ JUNCTIONT
OLEAD(
C/W)°
BOTH LEADS TO HEAT
SINK WITH LENGTHS
AS SHOWN
3/8"
1/4"
L = 1/8"
20
60
100
140
180
5.0
6.0
7.0
I(pk) = 5 Iavg
I(pk) = 10 Iavg
I(pk) = 20 Iavg
10 Iavg
I(pk) = 5 Iavg
RESISTIVE INDUCTIVE LOADS
BOTH LEADS TO HEAT
SINK, EQUAL LENGTH
6
F (IPK/IAVE = 6.28)
SEE NOTE
RqJA = 40°C/W
SEE NOTE
RqJA = 25°C/W
NOTES
THERMAL CIRCUIT MODEL
(For Heat Conduction Through The Leads)
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