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参数资料
| 型号： | MRFIC1859 |
| 厂商： | Motorola, Inc. |
| 英文描述： | Dual-Band GSM 3.6V Integrated RF Power Amplifier(GSM 3.6V集成式射频功放) |
| 中文描述： | 双频GSM 3.6V的集成RF功率放大器（手机3.6V的集成式射频功放） |
| 文件页数： | 14/15页 |
| 文件大小： | 180K |
| 代理商： | MRFIC1859 |
MRFIC1859
14
MOTOROLA WIRELESS SEMICONDUCTOR
SOLUTIONS – RF AND IF DEVICE DATA
PLASTIC PACKAGE
CASE 873E–02
(TQFP–32EP)
ISSUE A
D
OUTLINE DIMENSIONS
E1
D
E
ììììì
ììììì
ììììì
(b)
DIM
A
A1
A2
b
b1
C
C1
D
D1
e
E
E1
L
L1
M
N
MIN
–––
0.039
0.95
0.17
0.17
0.09
0.09
MAX
1.13
0.089
1.05
0.27
0.23
0.2
0.16
MILLIMETERS
7 BSC
5 BSC
0.5 BSC
7 BSC
5 BSC
0.45
0.75
R1
R2
S
0.08
0.08
0.2
0
0
11
11
–––
0.2
–––
7
–––
13
13
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M 1994.
3. DATUMS A, B AND D TO BE DETERMINED AT DATUM
PLANE H.
4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25–MM
PER SIDE. D1 AND E1 ARE MAXIMUMPLASTIC BODY
SIZE DIMENSIONS INCLUDING MOLD MISMATCH.
5. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED THE
MAXIMUMb DIMENSION BY MORE THAN 0.08–MM.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUMSPACE BETWEEN A
PROTRUSION AND ADJACENT LEAD IS 0.07–MM
6. EXACT SHAPE OF CORNERS IS OPTIONAL.
A–B
0.2
C
0.25
D
G
G
A
6
32
1
4X
B
A–B
0.2
D
H
4X
C
SEATING
28X
e
F
32X
b
0.08
A–B
M
D
C
0.08 C
H
AA2
A1
2
R1
R2
GAGE
S
L
(L1)
c1
c
BASE METAL
PLATING
1
2
3
1 REF
°
°
°
°
°
°
°
4X
e/2
SECTION G–G
DETAIL F
1
3
M
N
EXPOSED FLAG
VIEW J–J
2.09
2.09
2.19
2.19
E/2
25
24
D/2
E1/2
D1/2
D1
8
9
16
J
J
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