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参数资料
| 型号： | MSC8126TMP6400 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 数字信号处理 |
| 英文描述： | 0-BIT, 400 MHz, OTHER DSP, PBGA431 |
| 封装： | 20 X 20 MM, PLASTIC, FCBGA-431 |
| 文件页数： | 7/48页 |
| 文件大小： | 1138K |
| 代理商： | MSC8126TMP6400 |
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Electrical Characteristics
MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15
Freescale Semiconductor
15
This section describes the DC electrical characteristics for the MSC8126. The measurements in Table 5 assume the
following system conditions:
TA = 25 °C
VDD =
— 400 MHz = 1.14–1.26 VDC
— 500 MHz = 1.16–1.24 VDC
VDDH = 3.3 V ± 5% VDC
GND
= 0 VDC
Note:
The leakage current is measured for nominal VDDH and VDD.
Table 5. DC Electrical Characteristics
Characteristic
Symbol
Min
Typical
Max
Unit
Input high voltage1, all inputs except CLKIN
VIH
2.0
—
3.465
V
Input low voltage1
VIL
GND
0
0.8
V
CLKIN input high voltage
VIHC
2.4
3.0
3.465
V
CLKIN input low voltage
VILC
GND
0
0.8
V
Input leakage current, VIN = VDDH
IIN
–1.0
0.09
1
A
Tri-state (high impedance off state) leakage current, VIN = VDDH
IOZ
–1.0
0.09
1
A
Signal low input current, VIL = 0.8 V
2
IL
–1.0
0.09
1
A
Signal high input current, VIH = 2.0 V
2
IH
–1.0
0.09
1
A
Output high voltage, IOH = –2 mA,
except open drain pins
VOH
2.0
3.0
—
V
Output low voltage, IOL= 3.2 mA
VOL
—0
0.4
V
VCCSYN PLL supply current
IVCCSYN
—2
4
mA
Internal supply current:
Wait mode
Stop mode
IDDW
IDDS
—
3753
2903
—
mA
Typical power 400 MHz at 1.2 V4
P
—
1.15
—
W
Notes:
1.
See Figure 5 for undershoot and overshoot voltages.
2.
Not tested. Guaranteed by design.
3.
Measured for 1.2 V core at 25°C junction temperature.
4.
The typical power values were measured using an EFR code with the device running at a junction temperature of 25°C. No
peripherals were enabled and the ICache was not enabled. The source code was optimized to use all the ALUs and AGUs and
all four cores. It was created using CodeWarrior 2.5. These values are provided as examples only. Power consumption is
application dependent and varies widely. To assure proper board design with regard to thermal dissipation and maintaining
proper operating temperatures, evaluate power consumption for your application and use the design guidelines in Chapter 4 of
this document and in MSC8102, MSC8122, and MSC8126 Thermal Management Design Guidelines (AN2601).
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