参数资料
型号: MSM63182A-XXX
厂商: LAPIS SEMICONDUCTOR CO LTD
元件分类: 微控制器/微处理器
英文描述: 4-BIT, MROM, 2 MHz, MICROCONTROLLER, UUC107
封装: 4.44 X 4.92 MM, 0.35 MM HEIGHT, DIE-107
文件页数: 22/30页
文件大小: 228K
代理商: MSM63182A-XXX
FEDL63182A-02
1Semiconductor
MSM63182A
28/29
PACKAGE DIMENSIONS
QFP128-P-1420-0.50-K
Mirror finish
Package material
Epoxy resin
Lead frame material
42 alloy
Pin treatment
Solder plating (
≥5m)
Package weight (g)
1.19 TYP.
5
Rev. No./Last Revised
4/Nov. 28, 1996
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product
name, package name, pin number, package code and desired mounting conditions (reflow method,
temperature and times).
(Unit: mm)
相关PDF资料
PDF描述
MSM63184-XXX 4-BIT, MROM, MICROCONTROLLER, UUC
MSM63184-XXXGS-K 4-BIT, MROM, MICROCONTROLLER, PQFP128
MSM63184B-XXX 4-BIT, MROM, 2 MHz, MICROCONTROLLER, UUC123
MSM63188-XXX 4-BIT, MROM, 2 MHz, MICROCONTROLLER, UUC159
MSM63188-XXXGS-BK 4-BIT, MROM, 2 MHz, MICROCONTROLLER, PQFP176
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