参数资料
型号: MSM63182A-XXX
厂商: LAPIS SEMICONDUCTOR CO LTD
元件分类: 微控制器/微处理器
英文描述: 4-BIT, MROM, 2 MHz, MICROCONTROLLER, UUC107
封装: 4.44 X 4.92 MM, 0.35 MM HEIGHT, DIE-107
文件页数: 28/30页
文件大小: 228K
代理商: MSM63182A-XXX
FEDL63182A-02
1Semiconductor
MSM63182A
6/29
PAD CONFIGURATION
Pad Layout
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
75
74
73
Y
X
SEG0
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
SEG12
SEG13
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
SEG20
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
SEG28
SEG29
SEG30
SEG31
P5.2
P5.1
P5.0
P4.3
P4.2
P4.1
P4.0
P0.3
P0.2
P0.1
P0.0
P8.3
P8.2
P8.1
P8.0
P9.3
P9.2
P9.1
P9.0
PA.3
PA.2
PA.1
PA.0
P1.3
P1.2
P1.1
P1.0
P6.3
P6.2
P6.1
P6.0
P7.3
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
P5
.3
TST1
TST2
XT
0
XT
1
RESET
OS
C0
OS
C1
V
DDL
V
DD
CB2
CB1
V
DDH
C2
C1
V
DD5
V
DD4
V
DD3
V
DD2
V
DD1
V
SS
1
2
3
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
4
5
6
P7
.2
P7
.1
P7
.0
CO
M
1
CO
M
2
CO
M
3
CO
M
4
CO
M
5
CO
M
6
CO
M
7
CO
M
8
CO
M
9
CO
M
1
0
CO
M
1
CO
M
1
2
CO
M
1
3
CO
M
1
4
CO
M
1
5
CO
M
1
6
BD
BDB
V
DDI
(0, 0)
08M
63182
Chip Size
: 4.44 mm
× 4.92 mm
Chip Thickness
: 350
m (typ.)
Coordinate Origin : Chip center
Pad Hole Size
: 100
m × 100 m
Pad Size
: 110
m × 110 m
Minimum Pad Pitch: 140
m
Note: The chip substrate voltage is V
SS.
相关PDF资料
PDF描述
MSM63184-XXX 4-BIT, MROM, MICROCONTROLLER, UUC
MSM63184-XXXGS-K 4-BIT, MROM, MICROCONTROLLER, PQFP128
MSM63184B-XXX 4-BIT, MROM, 2 MHz, MICROCONTROLLER, UUC123
MSM63188-XXX 4-BIT, MROM, 2 MHz, MICROCONTROLLER, UUC159
MSM63188-XXXGS-BK 4-BIT, MROM, 2 MHz, MICROCONTROLLER, PQFP176
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