参数资料
型号: MSP430F2101TRGE
厂商: TEXAS INSTRUMENTS INC
元件分类: 微控制器/微处理器
英文描述: 16-BIT, FLASH, 16 MHz, RISC MICROCONTROLLER, PQCC24
封装: PLASTIC, QFN-24
文件页数: 47/95页
文件大小: 1832K
代理商: MSP430F2101TRGE
MSP430x23x, MSP430x24x(1), MSP430x2410
MIXED SIGNAL MICROCONTROLLER
SLAS547D -- JUNE 2007 -- REVISED APRIL 2010
51
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
crystal oscillator, LFXT1, high-frequency modes (see Note 5)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX UNIT
fLFXT1,HF0
LFXT1 oscillator crystal frequency,
HF mode 0
XTS = 1, LFXT1Sx = 0, XCAPx = 0
1.8 V to 3.6 V
0.4
1
MHz
fLFXT1,HF1
LFXT1 oscillator crystal frequency,
HF mode 1
XTS = 1, LFXT1Sx = 1, XCAPx = 0
1.8 V to 3.6 V
1
4
MHz
LFXT1
ill t
t l f
1.8 V to 3.6 V
2
10
fLFXT1,HF2
LFXT1 oscillator crystal frequency,
HF mode 2
XTS = 1, LFXT1Sx = 2, XCAPx = 0
2.2 V to 3.6 V
2
12
MHz
fLFXT1,HF2
HF mode 2
XTS 1, LFXT1Sx 2, XCAPx 0
3Vto 3.6V
2
16
MHz
LFXT1
ill t l i l
l
1.8 V to 3.6 V
0.4
10
fLFXT1,HF,logic
LFXT1 oscillator logic level square
wave input frequency HF mode
XTS = 1, LFXT1Sx = 3, XCAPx = 0
2.2 V to 3.6 V
0.4
12
MHz
fLFXT1,HF,logic wave input frequency, HF mode
XTS 1, LFXT1Sx 3, XCAPx 0
3Vto 3.6V
0.4
16
MHz
XTS = 1, XCAPx = 0, LFXT1Sx = 0,
fLFXT1,HF =1MHz,
CL,eff =15pF
2700
OAHF
Oscillation allowance for HF
crystals
(see Figure 23 and Figure 24)
XTS = 1, XCAPx = 0, LFXT1Sx = 1
fLFXT1,HF =4MHz,
CL,eff =15pF
800
(see Figure 23 and Figure 24)
XTS = 1, XCAPx = 0, LFXT1Sx = 2
fLFXT1,HF =16MHz,
CL,eff =15pF
300
CL,eff
Integrated effective load
capacitance, HF mode
(see Note 1)
XTS = 1, XCAPx = 0 (see Note 2)
1
pF
Duty cycle
HF mode
XTS = 1, XCAPx = 0, Measured at
P1.4/SMCLK, fLFXT1,HF =10MHz
2 2 V/3 V
40
50
60
%
Duty cycle
HF mode
XTS = 1, XCAPx = 0, Measured at
P1.4/SMCLK, fLFXT1,HF =16MHz
2.2 V/3V
40
50
60
%
fFault,HF
Oscillator fault frequency, HF
mode (see Note 4)
XTS = 1, LFXT1Sx = 3, XCAPx = 0
(see Notes 3)
2.2 V/3 V
30
300
kHz
NOTES: 1. Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
2. Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
3. Measured with logic level input frequency but also applies to operation with crystals.
4. Frequencies below the MIN specification will set the fault flag, frequencies above the MAX specification will not set the fault flag.
Frequencies in between might set the flag.
5. To improve EMI on the LFXT1 oscillator the following guidelines should be observed.
-- Keep the trace between the device and the crystal as short as possible.
-- Design a good ground plane around the oscillator pins.
-- Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
-- Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
-- Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
-- If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
-- Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other
documentation. This signal is no longer required for the serial programming adapter.
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