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参数资料
| 型号： | NBSG11BAEVB |
| 厂商： | ON Semiconductor |
| 文件页数： | 5/12页 |
| 文件大小： | 0K |
| 描述： | BOARD EVALUATION BBG NBSG11BA |
| 标准包装： | 1 |
| 主要目的： | 计时，时钟分配 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | NBSG11 |
| 已供物品： | 板 |
| 其它名称： | NBSG11BAEVB-ND NBSG11BAEVBOS |
NBSG11
http://onsemi.com
2
Figure 1. BGA16 Pinout (Top View)
VTCLK
CLK
VEE
VTCLK
NC
VEE
NC
Q1
VCC
NC
Q0
Q1
A
B
C
D
12
3
4
VEE NC
NC VCC
VEE NC
NC
VCC
Q0
Q1
VTCLK
CLK
VTCLK
56
7
8
16
15
14
13
12
11
10
9
1
2
3
4
NBSG11
Exposed Pad (EP)
Figure 2. QFN16 Pinout (Top View)
Table 1. PIN DESCRIPTION
Pin
Name
I/O
Description
BGA
QFN
D1
1
VTCLK
Internal 50 W Termination Pin. See Table 2.
C1
2
CLK
ECL, CML,
LVCMOS, LVDS,
LVTTL Input
Inverted Differential Input. Internal 75 kW to VEE and 36.5 kW to VCC.
B1
3
CLK
ECL, CML,
LVCMOS, LVDS,
LVTTL Input
Noninverted Differential Input. Internal 75 kW to VEE.
A1
4
VTCLK
Internal 50 W Termination Pin. See Table 2.
B2,C2
5,16
VEE
Negative Supply Voltage
A2,A3,D2,
D3
6,7,14,15
NC
No Connect
B3,C3
8,13
VCC
Positive Supply Voltage
A4
9
Q1
RSECL Output
Inverted Differential Output 1. Typically Terminated with 50 W to
VTT = VCC 2.0 V*.
B4
10
Q1
RSECL Output
Noninverted Differential Output 1. Typically Terminated with 50 W to
VTT = VCC 2.0 V*.
C4
11
Q0
RSECL Output
Inverted Differential output 0. Typically Terminated with 50 W to
VTT = VCC 2.0 V*.
D4
12
Q0
RSECL Output
Noninverted Differential Output 0. Typically Terminated with 50 W to
VTT = VCC 2.0 V*.
N/A
EP
The Exposed Pad (EP) and the QFN16 package bottom is thermally con-
nected to the die for improved heat transfer out of package. The exposed
pad must be attached to a heatsinking conduit. The pad is not electrically
connected to the die but may be electrically and thermally connected to VEE
on the PC board.
*Devices in BGA package typically terminated with 50 W to VTT = VCC 1.5 V.
1. The NC pins are electrically connected to the die and must be left open.
2. All VCC and VEE pins must be externally connected to Power Supply to guarantee proper operation. The thermally exposed pad on package
bottom (see case drawing) must be attached to a heatsinking conduit.
3. In the differential configuration when the input termination pins (VTCLK, VTCLK) are connected to a common termination voltage, and
if no signal is applied then the device will be susceptible to selfoscillation.
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相关代理商/技术参数 |
参数描述 |
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| NBSG11BAHTBG | 功能描述:时钟驱动器及分配 BBG 1:2 DIFF CLOCK DRIVER RoHS:否 制造商:Micrel 乘法/除法因子:1:4 输出类型:Differential 最大输出频率:4.2 GHz 电源电压-最大: 电源电压-最小:5 V 最大工作温度:+ 85 C 封装 / 箱体:SOIC-8 封装:Reel |
| NBSG11BAR2 | 功能描述:时钟缓冲器 2.5V/3.3V SiGE 1:2 RoHS:否 制造商:Texas Instruments 输出端数量:5 最大输入频率:40 MHz 传播延迟（最大值）: 电源电压-最大:3.45 V 电源电压-最小:2.375 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LLP-24 封装:Reel |
| NBSG11MAG | 功能描述:IC CLK BUFFER 1:2 12GHZ 16-FCLGA RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:- 标准包装:1 系列:HiPerClockS™ 类型:扇出缓冲器（分配），多路复用器 电路数:1 比率 - 输入:输出:2:18 差分 - 输入:输出:是/无 输入:CML，LVCMOS，LVPECL，LVTTL，SSTL 输出:LVCMOS，LVTTL 频率 - 最大:250MHz 电源电压:2.375 V ~ 3.465 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:32-LQFP 供应商设备封装:32-TQFP（7x7） 包装:- 其它名称:800-1923-6 |
| NBSG11MN | 功能描述:时钟缓冲器 2.5V/3.3V SiGE 1:2 RoHS:否 制造商:Texas Instruments 输出端数量:5 最大输入频率:40 MHz 传播延迟（最大值）: 电源电压-最大:3.45 V 电源电压-最小:2.375 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LLP-24 封装:Reel |
| NBSG11MNG | 功能描述:时钟缓冲器 2.5V/3.3V SiGE 1:2 Diff Clock w/RSECL RoHS:否 制造商:Texas Instruments 输出端数量:5 最大输入频率:40 MHz 传播延迟（最大值）: 电源电压-最大:3.45 V 电源电压-最小:2.375 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LLP-24 封装:Reel |
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