参数资料
| 型号： | NCN8025MTTBG |
| 厂商： | ON Semiconductor |
| 文件页数： | 11/15页 |
| 文件大小： | 0K |
| 描述： | IC SMART CARD I2C 16-QFN |
| 标准包装： | 1 |
| 系列： | * |
| 其它名称： | NCN8025MTTBGOSDKR |
NCN8025 / NCN8025A
http://onsemi.com
5
ATTRIBUTES
Characteristics
Values
ESD protection
Human Body Model (HBM) (Note 1)
Card Pins (card interface pins 311)
All Other Pins
Machine Model (MM)
Card Pins (card interface pins 311)
All Other Pins
8 kV
2 kV
400 V
150 V
Moisture sensitivity (Note 2) QFN24 and QFN16
Level 1
Flammability Rating Oxygen Index: 28 to 34
UL 94 V0 @ 0.125 in
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. Human Body Model (HBM), R = 1500 W, C = 100 pF.
2. For additional information, see Application Note AND8003/D.
MAXIMUM RATINGS (Note 3)
Rating
Symbol
Value
Unit
Regulator Power Supply Voltage
VDDP
0.3 ≤ VDDP ≤ 5.5
V
Power Supply from Microcontroller Side
VDD
0.3 ≤ VDD ≤ 5.5
V
External Card Power Supply
CVCC
0.3 ≤ CVCC ≤ 5.5
V
Digital Input Pins
Vin
0.3 ≤ Vin ≤ VDD
V
Digital Output Pins (I/Ouc, AUX1uc, AUX2uc, INT)
Vout
0.3 ≤ Vout ≤ VDD
V
Smart card Output Pins
Vout
0.3 ≤ Vout ≤ CVCC
V
Thermal Resistance JunctiontoAir (Note 4)
QFN24
QFN16
RqJA
37
48
°C/W
Operating Ambient Temperature Range
TA
40 to +85
°C
Operating Junction Temperature Range
TJ
40 to +125
°C
Maximum Junction Temperature
TJmax
+125
°C
Storage Temperature Range
Tstg
65 to + 150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25°C.
4. Exposed Pad (GND) must be connected to PCB.
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